A method for measuring and calibrating the thickness of thin films based on infrared interference technology

Transparent thin films are critical industrial components widely used in advanced optics, microelectronics and materials science, among other relevant fields. The rapid and stable measurement of sub-micron industrial film thickness is of particular importance. In this study, a novel method based on the principles of infrared inter-ference and laser profilometry is proposed to calculate the periodogram of the original spectrum and accurately extract the maximum frequency. In addition, a high-precision, compact and low-cost thin-film thickness mea-surement and calibration system is developed. This system achieves accurate measurement of single-layer film thickness and adapts to correct errors caused by slight tilt due to mechanical vibration or misalignment during film placement. Experimental data show that, compared to conventional infrared interference thickness mea-surement systems, the use of the proposed maximum frequency extraction algorithm improves measurement accuracy by approximately 90% and stability by approximately 70%. Furthermore, even when measuring the thickness of films with inclined components, the use of the constructed thin film thickness measurement and calibration system provides equivalent results.

Automated summary

A novel method based on infrared interference and laser profilometry is proposed to calculate the periodogram of the original spectrum and accurately extract the maximum frequency. A high-precision, compact and low-cost thin-film thickness measurement and calibration system is developed. Experimental data show that the proposed method improves measurement accuracy by approximately 90% and stability by approximately 70%.