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Research Progress of Micro-LED Display Technology

Journal

CRYSTALS
Volume 13, Issue 7, Pages -

Publisher

MDPI
DOI: 10.3390/cryst13071001

Keywords

Micro-LED; display technology; epitaxy technology; mass transfer; full-color display; bonding technology; driving technology

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This paper discusses the key technologies involved in Micro-LED display technology, including chip technology, mass transfer, full-color display, bonding, and driving technology. It emphasizes the wavelength uniformity, current density, and defect control for chip epitaxy technology, and discusses the challenges brought by miniaturization for chip process. It also summarizes several mainstream technical schemes for chip integration, full-color display, backplane bonding, and driving. Finally, it introduces chip detection and repair technologies and commercial applications.
Micro-LED display technology is considered to be the next generation of display technology, which has the characteristics of high miniaturization, thin film and integration, as well as the advantages of high brightness, high contrast, fast response speed and long service life. However, in the development of Micro-LED display technology, there are still some technical and cost problems to be solved. This paper focuses on the key technologies involved in Micro-LED display technology, such as chip technology, mass transfer, full-color display, bonding and driving technology, the research history and frontier progress of these technologies are reviewed in detail. For chip epitaxy technology, the wavelength uniformity, current density and defect control are emphasized; for chip process, the two main chip structures and the challenges brought by miniaturization are discussed emphatically; for chip integration, full-color display, backplane bonding and driving, several mainstream technical schemes are summarized in turn. Finally, the chip detection and repair technologies and commercial application are introduced.

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