Related references
Note: Only part of the references are listed.Evaluation of Solder Joint Reliability in 3D Packaging Memory Devices under Thermal Shock
Shuai Zhou et al.
ELECTRONICS (2022)
A Review of Various Defects in PCB
V. Udaya Sankar et al.
JOURNAL OF ELECTRONIC TESTING-THEORY AND APPLICATIONS (2022)
Multilayer Laminated Copper Electrodeposits and Their Mechanical Properties
Han-Kyun Shin et al.
JOURNAL OF THE ELECTROCHEMICAL SOCIETY (2022)
Copper Trace Fatigue Life Modeling for Rigid Electronic Assemblies
Sandeep Menon et al.
IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY (2021)
Comparison of Tensile and Fatigue Properties of Copper Thin Film Depending on Process Method
Hyeon-Gyu Min et al.
APPLIED SCIENCES-BASEL (2020)
Experimental characterization of rolled annealed copper film used in flexible printed circuit boards: Identification of the elastic-plastic and low-cycle fatigue behaviors
Gautier Girard et al.
MICROELECTRONICS RELIABILITY (2020)
A new approach to evaluate the elastic modulus of metallic foils
C. O. W. Trost et al.
MATERIALS & DESIGN (2020)
Integrated circuit failure analysis and reliability prediction based on physics of failure
Jian Jiao et al.
ENGINEERING FAILURE ANALYSIS (2019)
Contact angle measurement for LiBr aqueous solutions on different surface materials used in absorption systems
Asier Martinez-Urrutia et al.
INTERNATIONAL JOURNAL OF REFRIGERATION-REVUE INTERNATIONALE DU FROID (2018)
Review of Mechanical Characterization Techniques for Thin Films Used in Flexible Electronics
Manideep Gunda et al.
CRITICAL REVIEWS IN SOLID STATE AND MATERIALS SCIENCES (2017)
Structure-dependent mechanical behavior of copper thin films
Yong-Seok Lee et al.
MATERIALS CHARACTERIZATION (2017)
High cycle fatigue properties of Cu films
T. Walter et al.
MICROELECTRONIC ENGINEERING (2015)
Size effect on deformation behavior and ductile fracture in microforming of pure copper sheets considering free surface roughening
B. Meng et al.
MATERIALS & DESIGN (2015)
Method development for the cyclic characterization of thin copper layers for PCB applications
K. Fellner et al.
CIRCUIT WORLD (2014)
Printed circuit boards: A review on the perspective of sustainability
Andre Canal Marques et al.
JOURNAL OF ENVIRONMENTAL MANAGEMENT (2013)
Bending Fatigue Study of Sputtered ITO on Flexible Substrate
Khalid Alzoubi et al.
JOURNAL OF DISPLAY TECHNOLOGY (2011)
Mechanical Properties of Copper Thin Films Used in Electronic Devices
Shengde Zhang et al.
11TH INTERNATIONAL CONFERENCE ON THE MECHANICAL BEHAVIOR OF MATERIALS (ICM11) (2011)
Fatigue behavior of electrically conductive adhesives
Bin Su et al.
JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY (2008)
Tensile and high cycle fatigue test of copper thin film
J. -H. Park et al.
MATERIALWISSENSCHAFT UND WERKSTOFFTECHNIK (2008)
Fatigue fracture of embedded copper conductors in multifunctional composite structures
H Kim et al.
COMPOSITES SCIENCE AND TECHNOLOGY (2006)
Printed circuit board industry
Joseph LaDou
INTERNATIONAL JOURNAL OF HYGIENE AND ENVIRONMENTAL HEALTH (2006)
A review of deformation and fatigue of metals at small size scales
T Connolley et al.
FATIGUE & FRACTURE OF ENGINEERING MATERIALS & STRUCTURES (2005)
Embedded components in printed circuit boards: a processing technology review
W Jillek et al.
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY (2005)
Contact angle measurements for adhesion energy evaluation of silver and copper films on parylene-n and SiO2 substrates
KS Gadre et al.
JOURNAL OF APPLIED PHYSICS (2003)
Share Paper
