☆ 4.6 Review

Recent Advances in Precision Diamond Wire Sawing Monocrystalline Silicon

MICROMACHINES (2023)

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Article Chemistry, Physical

Determination of Mechanical and Fracture Properties of Silicon Single Crystal from Indentation Experiments and Finite Element Modelling

Petr Skalka et al.

Summary: This study focuses on determining the cohesive energy density of silicon single crystals using experimental data, FE simulations, and an optimization procedure. Unlike previous studies, which focused on evaluating material toughness using multiple parameters, this study specifically looks at cohesive energy density for easy determination of material toughness. The approach developed in this study is also suitable for short cracks where linear fracture mechanics premise is violated.

MATERIALS (2021)

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Review Engineering, Manufacturing

Critical review on sustainable techniques in electrical discharge machining

Wuyi Ming et al.

Summary: This paper reviews the latest sustainable techniques in Electric Discharge Machining (EDM), including technologies to enhance energy efficiency, the introduction of dry-EDM process, and the evaluation of sustainable manufacturing processes considering gas and noise emissions indicators. The impact of these techniques on the environment, society, and economy are discussed, along with proposed directions for future research.

JOURNAL OF MANUFACTURING PROCESSES (2021)

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Article Automation & Control Systems

Tension analysis and fluctuation control of diamond multi-wire sawing machine

Chongning Liu et al.

Summary: This paper simulates the tension fluctuation of diamond wire during the operation of a diamond multi-wire sawing machine using ADAMS software, and the results are verified by experiments. The methods of controlling tension fluctuation are proposed and verified by simulation and experiments, which helps reduce the broken probability of diamond wire, prolong its service life, and improve its use efficiency.

INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY (2021)

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Review Engineering, Manufacturing

Influence of ultrasonic vibration assistance in manufacturing processes: A Review

Pankaj Sonia et al.

Summary: High precision and close tolerance are essential requirements for current manufacturing industries, especially in micro-fabrication. The continuous development of various materials and alloys aims to fulfill the application needs in critical conditions. Ultrasonic vibration assistance has been extensively applied in numerous manufacturing processes, demonstrating significant improvements in process performance.

MATERIALS AND MANUFACTURING PROCESSES (2021)

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Review Engineering, Manufacturing

A review on magnetic field assisted electrical discharge machining

Zhen Zhang et al.

Summary: Magnetic field-assisted electrical discharge machining (MF-EDM) is a new method for improving machining performance, especially for difficult-to-cut materials. The use of magnetic fields can enhance discharge status, increase material removal rate, reduce electrode wear rate, and maintain surface integrity.

JOURNAL OF MANUFACTURING PROCESSES (2021)

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Article Mechanics

Fracture strength of photovoltaic silicon wafers cut by diamond wire saw based on half-penny crack system

Liyuan Wang et al.

Summary: This paper established a fracture strength model of diamond wire cut silicon wafers through numerical simulation and mathematical analysis. The effects of cutting conditions and saw wire conditions on wafer fracture strength, as well as the relationship between fracture strength and subsurface micro-crack damage depth, were studied. The study results provide theoretical guidance for parameter optimization in the sawing process and reduction of wafer breakage probability.

ENGINEERING FRACTURE MECHANICS (2021)

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Article Automation & Control Systems

The machining accuracy and surface roughness of mono-crystalline silicon regarding wire lag and wire stiffness of endless diamond wire

Jian Qiu et al.

Summary: Endless diamond wire is a special application of diamond wire cutting, the factors affecting machining accuracy include wire web stiffness, tension, and fluctuation; wire position mainly determines machining accuracy; lateral wire bow is the main reason affecting machining accuracy.

INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY (2021)

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Article Physics, Applied

Strain rate-dependent tensile response of glassy silicon nanowires studied by accelerated atomistic simulations

Yanming Zhang et al.

Summary: This study reports the tensile mechanical properties of silicon nanowires with different intrinsic ductility at various strain rates. It was found that as the strain rate decreases, both brittle and ductile nanowires display weakened strength, with plasticity decreasing in the ductile ones. The reduced plasticity in ductile nanowires at lower strain rates is attributed to enhanced strain localization.

JOURNAL OF APPLIED PHYSICS (2021)

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Article Engineering, Industrial

Investigation on sawing performance of diamond frame saw based on reciprocating swing in processing hard stone

Peiyu Dong et al.

Summary: This research introduced an innovative motion mode of reciprocating swing in frame saw for cutting hard stones, establishing theoretical models for predicting sawing depth and interval of single segment. Sawing experiments on the frame saw prototype with the new motion mode showed improved cutting performance. The application of this new sawing mode reduced sawing arc length, decreased the number of segments involved simultaneously, and ensured the sawn slabs met product requirements.

JOURNAL OF MATERIALS PROCESSING TECHNOLOGY (2021)

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Review Materials Science, Ceramics

A review on laser drilling and cutting of silicon

Hong-Jian Wang et al.

Summary: The article summarizes various laser machining technologies for silicon, including drilling and cutting. It discusses liquid-assisted laser processing and laser-induced thermal crack propagation cutting technology. The mechanism and processing characteristics of laser stealth dicing are also described.

JOURNAL OF THE EUROPEAN CERAMIC SOCIETY (2021)

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Article Engineering, Electrical & Electronic

Finite element analysis on processing stress of polysilicon cut by diamond multi-wire saw

Dameng Cheng et al.

Summary: This paper investigates the application of diamond multi-wire sawing technology in slicing polycrystalline silicon wafers. By establishing a sawing force model and a finite element model, the distribution and coupling characteristics of sawing stress are studied, as well as the influence of process parameters and silicon wafer size on stress values. The results show that thermal stress is dominant, and coupling stress increases with higher saw wire speed and feed speed.

MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING (2021)

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Review Energy & Fuels

Review on Life Cycle Assessment of Solar Photovoltaic Panels

Vincenzo Muteri et al.

ENERGIES (2020)

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Article Automation & Control Systems

Study on process parameters of fabrication fine diameter electroplated diamond wire for slicing crystalline silicon solar cell

Hongshuang Li et al.

INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY (2020)

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Article Automation & Control Systems

Influence of ingot rocking on the surface quality of multi-wire sawing monocrystalline silicon wafers

Zhenqin Xu et al.

INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY (2020)

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Review Automation & Control Systems

A comprehensive review of theory and technology of glass molding process

Wuyi Ming et al.

INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY (2020)

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Article Engineering, Electrical & Electronic

Analytical prediction of subsurface microcrack damage depth in diamond wire sawing silicon crystal

Liyuan Wang et al.

MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING (2020)

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Review Engineering, Multidisciplinary

A comprehensive review of defect detection in 3C glass components

Wuyi Ming et al.

MEASUREMENT (2020)

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Review Materials Science, Ceramics

A comprehensive review of electric discharge machining of advanced ceramics

Wuyi Ming et al.

CERAMICS INTERNATIONAL (2020)

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Article Engineering, Mechanical

Experimental and numerical analysis of scratching induced damage during diamond wire sawing of silicon

Florian Wallburg et al.

WEAR (2020)

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Article Engineering, Manufacturing

Ultra-Precision Machining: Cutting With Diamond Tools

D. A. Lucca et al.

JOURNAL OF MANUFACTURING SCIENCE AND ENGINEERING-TRANSACTIONS OF THE ASME (2020)

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Article Energy & Fuels

Effect of cutting parameters on surface integrity of monocrystalline silicon sawn with an endless diamond wire saw

Erick Cardoso Costa et al.

SOLAR ENERGY (2020)

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Article Engineering, Mechanical

Dynamic crack modeling and analytical stress field analysis in single-crystal silicon using quantitative fractography

Anthony Moulins et al.

THEORETICAL AND APPLIED FRACTURE MECHANICS (2020)

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Article Engineering, Manufacturing

Evolution of nano-cracks in single-crystal silicon during ultraprecision mechanical polishing

Houfu Dai et al.

JOURNAL OF MANUFACTURING PROCESSES (2020)

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Article Engineering, Mechanical

Formation mechanism of wire bow and its influence on diamond wire saw process and wire cutting capability

Jian Qiu et al.

INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES (2020)

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Article Engineering, Electrical & Electronic

Mechanical strength problem of thin silicon wafers (120 and 140 μm) cut with thinner diamond wires (Si kerf 120 → 100 μm) for photovoltaic use

Halubai Sekhar et al.

MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING (2020)

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Article Environmental Studies

Study of China's optimal solar photovoltaic power development path to 2050

Mei Xu et al.

RESOURCES POLICY (2020)

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Article Materials Science, Composites

Simulation and Experimental Study on Surface Formation Mechanism in Machining of SiCp/Al Composites

Jinguang Du et al.

APPLIED COMPOSITE MATERIALS (2019)

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Article Engineering, Electrical & Electronic

The effect of cut depth and distribution for abrasives on wafer surface morphology in diamond wire sawing of PV polycrystalline silicon

Xinying Li et al.

MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING (2019)

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Review Engineering, Multidisciplinary

A review on cutting of industrial ceramic materials

Rahul Rakshit et al.

PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY (2019)

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Review Green & Sustainable Science & Technology

A techno-economic review of silicon photovoltaic module recycling

Rong Deng et al.

RENEWABLE & SUSTAINABLE ENERGY REVIEWS (2019)

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Article Chemistry, Analytical

Investigation on the Edge Chipping in Ultrasonic Assisted Sawing of Monocrystalline Silicon

Jianyun Shen et al.

MICROMACHINES (2019)

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Article Engineering, Industrial

Evaluation of fixed abrasive diamond wire sawing induced subsurface damage of solar silicon wafers

Huapan Xiao et al.

JOURNAL OF MATERIALS PROCESSING TECHNOLOGY (2019)

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Article Materials Science, Multidisciplinary

Rate-dependent traction-separation relations for a silicon/epoxy interface informed by experiments and bond rupture kinetics

Tianhao Yang et al.

JOURNAL OF THE MECHANICS AND PHYSICS OF SOLIDS (2019)

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Article Engineering, Electrical & Electronic

Material removal and surface generation mechanisms in diamond wire sawing of silicon crystal

Yufei Gao et al.

MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING (2019)

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Article Energy & Fuels

Comparative analysis of mechanical strength of diamond-sawn silicon wafers depending on saw mark orientation, crystalline nature and thickness

Louise Carton et al.

SOLAR ENERGY MATERIALS AND SOLAR CELLS (2019)

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Article Automation & Control Systems

Study on diamond wire wear, surface quality, and subsurface damage during multi-wire slicing of c-plane sapphire wafer

Ajay Gupta et al.

INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY (2019)

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Article Engineering, Mechanical

Modeling and verifying of sawing force in ultrasonic vibration assisted diamond wire sawing (UAWS) based on impact load

Yan Wang et al.

INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES (2019)

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Review Engineering, Manufacturing

Manufacturing technologies toward extreme precision

Zhiyu Zhang et al.

INTERNATIONAL JOURNAL OF EXTREME MANUFACTURING (2019)

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Article Automation & Control Systems

Modeling and analysis of wire motion during rocking mode diamond wire sawing of mono-crystalline alumina oxide wafer

Chao-Chang A. Chen et al.

INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY (2018)

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Article Automation & Control Systems

Experimental investigations of a hybrid machining combining wire electrical discharge machining (WEDM) and fixed abrasive wire saw

Xiaoyu Wu et al.

INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY (2018)

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Article Engineering, Industrial

Cutting of hard and brittle insulating materials using spark discharge-assisted diamond wire sawing

Jin Wang et al.

JOURNAL OF MATERIALS PROCESSING TECHNOLOGY (2018)

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Article Instruments & Instrumentation

Comparison of subsurface damages on mono-crystalline silicon between traditional nanoscale machining and laser-assisted nanoscale machining via molecular dynamics simulation

Houfu Dai et al.

NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION B-BEAM INTERACTIONS WITH MATERIALS AND ATOMS (2018)

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Article Engineering, Manufacturing

Surface integrity of alumina machined by electrochemical discharge assisted diamond wire sawing

Jin Wang et al.

JOURNAL OF MANUFACTURING PROCESSES (2018)

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Article Engineering, Manufacturing

Shape-cutting of quartz glass by spark discharge-assisted diamond wire sawing

Jin Wang et al.

JOURNAL OF MANUFACTURING PROCESSES (2018)

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Article Materials Science, Ceramics

Study on the subsurface microcrack damage depth in electroplated diamond wire saw slicing SiC crystal

Yufei Gao et al.

CERAMICS INTERNATIONAL (2018)

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Article Mechanics

Fracture properties of nanoscale single-crystal silicon plates: Molecular dynamics simulations and finite element method

Yu Wei et al.

ENGINEERING FRACTURE MECHANICS (2018)

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Proceedings Paper Materials Science, Multidisciplinary

On a Plasticity by Partial Dislocations in Silicon at Very High Stress

Jacques Rabier

MATERIALS TODAY-PROCEEDINGS (2018)

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Article Automation & Control Systems

Finite element analysis of multi-wire saw silicon rods with consolidated abrasive diamonds

Chaohua Wu et al.

INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY (2017)

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Article Automation & Control Systems

A novel numerical predicting method of electric discharge machining process based on specific discharge energy

Hao Huang et al.

INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY (2017)

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Article Engineering, Manufacturing

Analytical Force Modeling of Fixed Abrasive Diamond Wire Saw Machining With Application to SiC Monocrystal Wafer Processing

Shujuan Li et al.

JOURNAL OF MANUFACTURING SCIENCE AND ENGINEERING-TRANSACTIONS OF THE ASME (2017)

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Article Automation & Control Systems

Investigating the energy distribution of workpiece and optimizing process parameters during the EDM of Al6061, Inconel718, and SKD11

Wuyi Ming et al.

INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY (2017)

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Article Automation & Control Systems

Research on electrochemical discharge-assisted diamond wire cutting of insulating ceramics

Jin Wang et al.

INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY (2017)

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Article Automation & Control Systems

Experimental study on surface topography and fracture strength of worn saw wire in multi-wire sawing

Zhen Li et al.

INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY (2017)

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Article Materials Science, Ceramics

Effect of grit shape and crystal structure on damage in diamond wire scribing of silicon

Arkadeep Kumar et al.

JOURNAL OF THE AMERICAN CERAMIC SOCIETY (2017)

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Article Engineering, Electrical & Electronic

Subsurface crack damage in silicon wafers induced by resin bonded diamond wire sawing

Tengyun Liu et al.

MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING (2017)

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Article Engineering, Multidisciplinary

Mechanisms of material removal and subsurface damage in fixed-abrasive diamond wire slicing of single-crystalline silicon

Takaaki Suzuki et al.

PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY (2017)

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Article Chemistry, Multidisciplinary

Influence of laser nanostructured diamond tools on the cutting behavior of silicon by molecular dynamics simulation

Houfu Dai et al.

RSC ADVANCES (2017)

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Article Materials Science, Multidisciplinary

Interaction between phase transformations and dislocations at incipient plasticity of monocrystalline silicon under nanoindentation

Junjie Zhang et al.

COMPUTATIONAL MATERIALS SCIENCE (2017)

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Article Materials Science, Multidisciplinary

A method to optimize the diamond wire cutting process

S. Turchetta et al.

DIAMOND AND RELATED MATERIALS (2017)

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Article Engineering, Electrical & Electronic

Dislocation-mediated plasticity in silicon during nanometric cutting: A molecular dynamics simulation study

Saeed Zare Chavoshi et al.

MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING (2016)

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Review Engineering, Multidisciplinary

Wire sawing technology: A state-of-the-art review

Hao Wu

PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY (2016)

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Article Engineering, Mechanical

Effect of wear of diamond wire on surface morphology, roughness and subsurface damage of silicon wafers

Arkadeep Kumar et al.

WEAR (2016)

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Article Engineering, Manufacturing

Influence of temperature on the anisotropic cutting behaviour of single crystal silicon: A molecular dynamics simulation investigation

Saeed Zare Chavoshi et al.

JOURNAL OF MANUFACTURING PROCESSES (2016)

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Article Materials Science, Multidisciplinary

EFFECT OF STRAIN RATE ON TENSILE STRENGTH OF DEFECTIVE SILICON NANORODS

Tao Chen et al.

ACTA MECHANICA SOLIDA SINICA (2015)

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Article Materials Science, Multidisciplinary

Coulomb's law based interatomic potential for iron crystals in molecular statics applications

Oleg Vinogradov

COMPUTATIONAL MATERIALS SCIENCE (2015)

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Article Automation & Control Systems

Depth of cut per abrasive in fixed diamond wire sawing

Chunhui Chung et al.

INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY (2015)

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Article Automation & Control Systems

A new method for on-line monitoring discharge pulse in WEDM-MS process

Zhen Zhang et al.

INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY (2015)

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Article Engineering, Manufacturing

Size effect and minimum chip thickness in micromilling

Fernando Brandao de Oliveira et al.

INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE (2015)

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Article Nanoscience & Nanotechnology

Anisotropic etching in low-concentration KOH: effects of surfactant concentration

Prem Pal et al.

Micro & Nano Letters (2015)

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Article Automation & Control Systems

Distribution of diamond grains in fixed abrasive wire sawing process

Chunhui Chung et al.

INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY (2014)

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Article Automation & Control Systems

A hybrid process model for EDM based on finite-element method and Gaussian process regression

Wuyi Ming et al.

INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY (2014)

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Article Green & Sustainable Science & Technology

Impact of un-deformed chip thickness on specific energy in mechanical machining processes

Vincent A. Balogun et al.

JOURNAL OF CLEANER PRODUCTION (2014)

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Article Energy & Fuels

Structured wire: From single wire experiments to multi-crystalline silicon wafer mass production

Oliver Anspach et al.

SOLAR ENERGY MATERIALS AND SOLAR CELLS (2014)

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Article Instruments & Instrumentation

Anisotropic elasticity of silicon and its application to the modelling of X-ray optics

Lin Zhang et al.

JOURNAL OF SYNCHROTRON RADIATION (2014)

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Article Engineering, Manufacturing

Generation of diamond wire sliced wafer surface based on the distribution of diamond grits

Chunhui Chung et al.

INTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING (2014)

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Article Chemistry, Physical

Liquid polycarbosilane derived SiC coating on silicon (111) wafer for enhanced mechanical properties

Jonaki Mukherjee et al.

APPLIED SURFACE SCIENCE (2013)

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Article Multidisciplinary Sciences

Wire Saw Process-Induced Surface Damage Characterization

Egemen Teomete

ARABIAN JOURNAL FOR SCIENCE AND ENGINEERING (2013)

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Article Engineering, Manufacturing

Wire electrochemical discharge machining (WECDM) of quartz glass with titrated electrolyte flow

Kuan-Yuan Kuo et al.

INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE (2013)

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Article Computer Science, Interdisciplinary Applications

A multiscale modeling technique for bridging molecular dynamics with finite element method

Yongchang Lee et al.

JOURNAL OF COMPUTATIONAL PHYSICS (2013)

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Article Engineering, Electrical & Electronic

Silicon isotropic and anisotropic etching for MEMS applications

S. Negi et al.

MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS (2013)

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Article Engineering, Electrical & Electronic

Effect of crystal defects on mechanical properties relevant to cutting of multicrystalline solar silicon

Hao Wu et al.

MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING (2013)

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Proceedings Paper Materials Science, Multidisciplinary

Surface layer damage of silicon wafers sliced by wire saw process

Renke Kang et al.

ADVANCES IN ABRASIVE TECHNOLOGY XVI (2013)

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Article Materials Science, Multidisciplinary

Rate dependent deformation of a silicon nanowire under uniaxial compression: Yielding, buckling and constitutive description

Chi Yan Tang et al.

COMPUTATIONAL MATERIALS SCIENCE (2012)

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Review Automation & Control Systems

A state-of-the-art review of ductile cutting of silicon wafers for semiconductor and microelectronics industries

Muhammad Arif et al.

INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY (2012)

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Article Materials Science, Multidisciplinary

Study hot pressed Fe-diamond composites graphitization

Luciano Jose de Oliveira et al.

INTERNATIONAL JOURNAL OF REFRACTORY METALS & HARD MATERIALS (2012)

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Article Engineering, Industrial

Tool wear mechanisms and tool life enhancement in ultra-precision machining of titanium

A. R. Zareena et al.

JOURNAL OF MATERIALS PROCESSING TECHNOLOGY (2012)

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Review Energy & Fuels

Building integrated photovoltaic products: A state-of-the-art review and future research opportunities

Bjorn Petter Jelle et al.

SOLAR ENERGY MATERIALS AND SOLAR CELLS (2012)

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Proceedings Paper Materials Science, Multidisciplinary

Abrasive Distribution of the Fixed Diamond Wire in Wire Sawing Process

Chunhui Chung

ADVANCED MANUFACTURING FOCUSING ON MULTI-DISCIPLINARY TECHNOLOGIES (2012)

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Proceedings Paper Energy & Fuels

Textural development of SiC and diamond wire sawed sc-silicon wafer

B. Meinel et al.

PROCEEDINGS OF THE 2ND INTERNATIONAL CONFERENCE ON CRYSTALLINE SILICON PHOTOVOLTAICS (SILICONPV 2012) (2012)

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Article Engineering, Industrial

Abrasive electrochemical multi-wire slicing of solar silicon ingots into wafers

W. Wang et al.

CIRP ANNALS-MANUFACTURING TECHNOLOGY (2011)

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Article Engineering, Manufacturing

Roughness Damage Evolution Due to Wire Saw Process

Egemen Teomete

INTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING (2011)

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Article Chemistry, Multidisciplinary

Broadcasting Algorithms of Carbon Nanotubes

Paul Manuel et al.

JOURNAL OF COMPUTATIONAL AND THEORETICAL NANOSCIENCE (2011)

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Review Materials Science, Multidisciplinary

Development of hafnium based high-k materials-A review

J. H. Choi et al.

MATERIALS SCIENCE & ENGINEERING R-REPORTS (2011)

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Article Computer Science, Interdisciplinary Applications

Software design for a highly parallel molecular dynamics simulation framework in chemical engineering

M. Buchholz et al.

JOURNAL OF COMPUTATIONAL SCIENCE (2011)

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Article Economics

Cadmium flows and emissions from CdTe PV: future expectations

Marco Raugei et al.

ENERGY POLICY (2010)

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Article Engineering, Multidisciplinary

Detection of orientation-dependent, single-crystal diamond tool edge wear using cutting force sensors, while spin-turning silicon

Eric R. Marsh et al.

PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY (2010)

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Article Engineering, Manufacturing

A finite element analysis of temperature variation in silicon wafers during wiresaw slicing

Sumeet Bhagavat et al.

INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE (2008)

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Article Engineering, Industrial

Relationship between subsurface damage and surface roughness of optical materials in grinding and lapping processes

Shenyi Li et al.

JOURNAL OF MATERIALS PROCESSING TECHNOLOGY (2008)

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Article Materials Science, Multidisciplinary

Simulations of the mechanical properties of crystalline, nanocrystalline, and amorphous SiC and Si

V. I. Ivashchenko et al.

PHYSICAL REVIEW B (2007)

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Article Engineering, Manufacturing

Theoretical analysis on the effects of crystal anisotropy on wiresawing process and application to wafer slicing

S Bhagavat et al.

INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE (2006)

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Review Materials Science, Multidisciplinary

Strength and sharp contact fracture of silicon

RF Cook

JOURNAL OF MATERIALS SCIENCE (2006)

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Article Physics, Multidisciplinary

Atomistic configurations and energetics of crack extension in silicon

T Zhu et al.

PHYSICAL REVIEW LETTERS (2004)

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Article Engineering, Manufacturing

Fixed abrasive diamond wire saw slicing of single-crystal silicon carbide wafers

CW Hardin et al.

MATERIALS AND MANUFACTURING PROCESSES (2004)

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Article Materials Science, Coatings & Films

Evaluation of surface and subsurface cracks on nano-scale machined brittle materials by scanning force microscope and scanning laser microscope

M Nakamura et al.

SURFACE & COATINGS TECHNOLOGY (2003)

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