4.8 Article

High-resolution electrohydrodynamic inkjet printing of stretchable metal oxide semiconductor transistors with high performance

Journal

NANOSCALE
Volume 8, Issue 39, Pages 17113-17121

Publisher

ROYAL SOC CHEMISTRY
DOI: 10.1039/c6nr05577j

Keywords

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Funding

  1. Ministry of Science, ICT & Future Planning
  2. Ministry of Trade, Industry and Energy (MOTIE) of Korea through the National Research Foundation [2016R1A2B3013592, 2016R1A5A1009926]
  3. Technology Innovation Program [10044410]
  4. Nano Material Technology Development Program [2015M3A7B4050308, 2016M3A7B4910635]
  5. Convergence Technology Development Program for Bionic Arm [NRF-2014M3C1B2048198]
  6. Pioneer Research Center Program [NRF-2014M3C1A3001208]
  7. Human Resource Training Program for Regional Innovation and Creativity [NRF-2014H1C1A1073051]
  8. Development Program of Manufacturing Technology for Flexible Electronics with High Performance [SC0970]
  9. Korea Institute of Machinery and Materials
  10. Development Program of Internet of Nature System - UNIST [1.150090.01]

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As demands for high pixel densities and wearable forms of displays increase, high-resolution printing technologies to achieve high performance transistors beyond current amorphous silicon levels and to allow low-temperature solution processability for plastic substrates have been explored as key processes in emerging flexible electronics. This study describes electrohydrodynamic inkjet (e-jet) technology for direct printing of oxide semiconductor thin film transistors (TFTs) with high resolution (minimum line width: 2 mu m) and superb performance, including high mobility (similar to 230 cm(2) V-1 s(-1)). Logic operations of the amplifier circuits composed of these e-jet-printed metal oxide semiconductor (MOS) TFTs demonstrate their high performance. Printed In2O TFTs with e-jet printing-assisted high-resolution S/D electrodes were prepared, and the direct printing of passivation layers on these channels enhanced their gate-bias stabilities significantly. Moreover, low process temperatures (<250 degrees C) enable the use of thin plastic substrates; highly flexible and stretchable TFT arrays have been demonstrated, suggesting promise for next-generation printed electronics.

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