High-Performance Recyclable and Malleable Epoxy Resin with Vanillin-Based Hyperbranched Epoxy Resin Containing Dual Dynamic Bonds

Anefficient strategy for a vanillin-based hyperbranchedepoxy resin containing disulfide and imine dynamic covalent bondsis presented for the development of recyclable biobased materialstoward carbon neutrality. Dynamic covalent polymer networksrepresent new opportunitiesinthe design of sustainable epoxy resins due to their excellent malleabilityand reprocessability; however, the adaptable network is usually accompaniedby low glass transition temperature, poor creep resistance, and mechanicalbrittleness. Herein, we demonstrate a vanillin-based hyperbranchedepoxy resin (VEHBP) containing disulfide and imine dynamic covalentbonds for recyclable and malleable epoxy resin with high glass transitiontemperature (T (g)), significantly improvedcreep resistance, and mechanical properties. The dynamic covalentepoxy resin containing 5%VEHBP exhibited a high glass transition temperatureof 175 & DEG;C and a creep temperature of 130 & DEG;C and a 34.1,19.7, and 173.3% increase in tensile strength, storage modulus, andtensile toughness respectively, compared with the neat resin. Meanwhile,the hyperbranched topological structure of VEHBP complemented by dualdynamic bonds endowed these materials with excellent self-healingability, reprocessability, and degradability, which represents animportant step toward the design and fabrication of high-performanceepoxy covalent adaptable networks.

Automated summary

An efficient strategy utilizing disulfide and imine dynamic covalent bonds in a vanillin-based hyperbranched epoxy resin is proposed for the development of recyclable biobased materials. The resin demonstrates high glass transition temperature, improved creep resistance, mechanical properties, and exhibits self-healing ability, reprocessability, and degradability. This represents a significant advancement in the design of high-performance epoxy covalent adaptable networks.