Journal
POLYMERS
Volume 15, Issue 18, Pages -Publisher
MDPI
DOI: 10.3390/polym15183694
Keywords
additive manufacturing; dimensional analysis; geometric analogy; theory of similarity; structural optimization
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This review discusses the utilization of dimensional methods to address problems in additive manufacturing processes. It points out that this field has not fully explored the potential of these methods. The focus is mainly on polymer-based AM technology, exploring the design and optimization of highly competitive products and layer deposition.
It is a well-known fact that in the field of modern manufacturing processes, additive manufacturing (AM) offers unexpected opportunities for creativity and rapid development. Compared with classical manufacturing technologies, AM offers the advantages of reducing weight and improving performance and offers excellent design capabilities for prototyping and rapid sample manufacture. To achieve its full potential regarding cost, durability, material consumption, and rigidity, as well as maintaining competitiveness, there are several research directions that have not been explored. One less frequently explored direction is the involvement of dimensional methods in obtaining an optimal and competitive final product. In this review, we intend to discuss the ways in which dimensional methods, such as geometric analogy, similarity theory, and dimensional analysis, are involved in addressing the problems of AM. To the best of our knowledge, it appears that this field of engineering has not fully maximized the advantages of these dimensional methods to date. In this review, we survey mainly polymer-based AM technology. We focus on the design and optimization of highly competitive products obtained using AM and also on the optimization of layer deposition, including their orientation and filling characteristics. With this contribution to the literature, we hope to suggest a fruitful direction for specialists involved in AM to explore the possibilities of modern dimensional analysis.
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