Thermal analysis and optimization of metal foam PCM-based heat sink for thermal management of electronic devices

Efficient thermal management in electric devices is highly essential for ensuring the reliability and durability of electronics. This study aims to investigate the thermal performance and optimization of metal foam PCM-based heat sink for thermal management units. Different design parameters, such as PCM types (RT31, RT42, and RT55), metal foam porosities (85%, 90%, and 95%), and metal foam materials, are studied to determine heat sink optimal parameters, considering various critical temperatures: 40 degrees C, 50 degrees C, 60 degrees C and 70 degrees C. The volume -averaged method is used to simulate the heat transfer, phase change, and fluid flow within the heat sink unit. Heat transfer between PCM and metal foam is established using a thermal non-equilibrium model. The results show that the usage of metal foam is conducive to the thermal performance enhancement of heat sinks. Among the three parameters, PCM types show a considerable effect on thermal performance of heat sinks, e.g., the maximum operation time of heat sinks with RT31 is about 5 times that of heat sinks with RT55 for the critical temperature of 40 degrees C. Among all the cases, heat sinks using RT31 and aluminum foam perform optimally, which can achieve the optimal design of heat sinks.

Automated summary

Efficient thermal management is crucial for the reliability and durability of electric devices. This study investigates the thermal performance and optimization of metal foam PCM-based heat sink. Different design parameters are studied to determine the optimal heat sink parameters. The results show that metal foam enhances the thermal performance of heat sinks, and heat sinks using RT31 and aluminum foam perform optimally.