Journal
POLYMER COMPOSITES
Volume -, Issue -, Pages -Publisher
WILEY
DOI: 10.1002/pc.27765
Keywords
glass-transition; polymer nanocomposites; silver nanoparticles; storage modulus; tensile strength; thermal conductivity
Categories
Ask authors/readers for more resources
This article investigates the polymer nanocomposites of polyisoprene blended with varying concentrations of synthesized silver nanoparticles. Experimental results show that the addition of AgNPs reduces storage modulus, activation energy, and fragility, while enhancing damping. The glass transition temperature remains unaffected. The incorporation of AgNPs increases toughness and tensile strength up to a certain concentration, but a decrease is observed at higher concentrations. Young's modulus decreases significantly with the addition of AgNPs, but increases at higher concentrations. Thermal analysis reveals an enhancement in thermal conductivity with an increase in AgNPs concentration.
In this article, polymer nanocomposites of polyisoprene with specific blend ratio 25/75 wt% of cis-polyisoprene (CPI) and trans-polyisoprene (TPI) with varying concentration (0.1, 1, and 5 wt%) of so synthesized silver nanoparticles (AgNPs) have been prepared and characterized through x-ray diffraction, transmission electron microscope and scanning electron microscope. Experimental results on dynamic mechanical analysis show that addition of AgNPs to CPI/TPI blend reduces storage modulus, activation energy and fragility while enhances damping, however, glass transition temperature remains unaffected. Other mechanical properties such as toughness and tensile strength first increases on addition of AgNPs in the CPI/TPI blend, but a decrease is noticed on further increase of AgNPs concentration. Young's modulus shows a drastic decrease on addition of AgNPs into CPI/TPI blend, however, an increase is observed at higher concentration of AgNPs. Thermal analysis results show that thermal conductivity enhances with the enhancement in concentration of AgNPs into CPI/TPI blend.HighlightsAddition of AgNPs into CPI/TPI blend reduces storage modulus, activation energy and fragilityIncorporation of AgNPs into CPI/TPI blend enhances damping but does not change glass transition temperature.Increase in concentration of AgNPs in CPI/TPI blend increases the thermal conductivity. In this article, polymer nanocomposites of CPI/TPI specific blend with AgNPs have been prepared and characterized through DMA and TCA.image
Authors
I am an author on this paper
Click your name to claim this paper and add it to your profile.
Reviews
Recommended
No Data Available