4.4 Article

A Study on the Influence of Metal Fe, Ag, and Mn Doping and (Fe/Mn and Ag/Mn) Dual-Doping on the Structural, Morphological, Optical, and Antibacterial Activity of CuS Nanostructures

Journal

PLASMONICS
Volume -, Issue -, Pages -

Publisher

SPRINGER
DOI: 10.1007/s11468-023-02027-0

Keywords

Copper sulfide; Single-doping; Dual-doping; Hydrothermal technique; Antibacterial activity

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CuS nanostructures with high surface areas were successfully synthesized via a hydrothermal method and characterized. These nanostructures exhibited excellent antibacterial activity.
CuS nanostructures with high surface areas were produced through a hydrothermal method using simple materials. These included pure CuS, as well as CuS doped with Fe, Ag, and Mn, as well as dual-doped with Fe/Mn and Ag/Mn. X-ray diffraction (XRD), field-emission scanning electron microscopes (FE-SEM), chemical composition (EDX) analysis, zeta potential, ultraviolet-visible (UV-vis) absorption spectra, and compositional chemicals (FTIR) have been used to characterize the produced nanoparticles. The XRD patterns indicate that the CuS is in hexagonal covellite polycrystalline phases with estimated crystalline sizes of 25.14-14.25 nm. The optical measurements showed that the band gaps ranged from 3.19 to 2.24 eV. The inhibitory effects of pristine CuS, as well as CuS doping with Fe, Ag, and Mn and dual-doping with (Fe/Mn, Ag/Mn), against Pseudomonas aeruginosa, Staphylococcus aureus, and Escherichia coli, were evaluated using the inhibition zone method. All samples exhibited robust antibacterial activity against all strains. The highest level of inhibition against all strains was observed with a concentration of 4 mg/ml of copper sulfide. Out of all the tested samples, (Ag/Mn) dual-doped copper sulfide showed the highest antibacterial activity against both negative-gram and positive-gram bacteria. Hence, (Ag/Mn) dual-doped copper sulfide might be applied as an antibacterial agent with antibiotics to kill and prevent resistance bacterial development.

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