Decomposition of SF6 by a plasma focus device

Decomposition of SF6 by a low energy plasma focus (PF) device has been investigated. The PF device performance in SF6 atmosphere was weaker than other gases such as argon, methane and nitrogen. Tungsten and vanadium anode tips were employed to generate thin layers of deposited products on substrates with different number of focused shots in SF6 atmosphere. The proper choice of the anode tip and substrate material has a direct effect on SF6 decomposition and generation of desire products. Free fluorine atoms and ions are produced during discharges that react with housing chamber and corrode the device materials such as Pyrex insulator, 304 stainless steel chamber and many more. Field emission scanning electron microscope (FESEM), energy dispersive X-ray (EDX), grazing incidence X-ray diffraction (GIXRD) and X-ray photoelectron spectroscopy (XPS) were utilized to identify the deposited solid film products. & COPY; 2023 Elsevier B.V. All rights reserved.

Automated summary

The decomposition of SF6 by a low energy plasma focus device was investigated. The performance of the device in SF6 atmosphere was weaker compared to other gases such as argon, methane, and nitrogen. The choice of anode tip and substrate material had a direct effect on SF6 decomposition and the generation of desired products. Free fluorine atoms and ions produced during discharges reacted with the device materials and caused corrosion.