Journal
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
Volume 163, Issue -, Pages -Publisher
ELSEVIER SCI LTD
DOI: 10.1016/j.mssp.2023.107594
Keywords
Coherent interface; SiC machining; Atomistic simulation; Modification layer; Surface mechanical properties
Ask authors/readers for more resources
Surface modification layers are important in reaction-assisted machining as they affect the behavior of the surface and interface. Experimentally determining the impact of surface mechanical properties on a coherent interface is challenging, hence atomistic simulations were performed to study this behavior. The findings showed that a soft layer acted as a buffer to reduce substrate stress, while a modification layer enhanced efficiency at greater penetration depths and altered near-interface dynamics. It was also suggested that the effect of a harder modification layer on the interface may be more significant than the mechanical properties difference between the modification layer and substrate.
Surface modification layers play a crucial role in enhancing machinability during reaction-assisted machining due to the interrelated behavior of the surface and interface resulting from their structure-properties relationship. However, determining the impact of surface mechanical properties on a coherent interface through experiments is challenging. To overcome this limitation, atomistic simulations were performed, which involved constructing coherent interfaces with varying mechanical properties by adjusting the Tersoff-style potential function. The 4H-SiC machining example involved introducing soft, pristine, and modification layers. The findings indicated that the soft layer acted as a buffer, reducing substrate stress, while the modification layer enhanced efficiency at greater penetration depths, and near-interface dynamic behaviors were altered. Additionally, it was indirectly suggested that the effect of a harder modification layer on the interface may be more significant than the difference in mechanical properties between the modification layer and substrate.
Authors
I am an author on this paper
Click your name to claim this paper and add it to your profile.
Reviews
Recommended
No Data Available