Reliability-enhanced microscale Ag sintered joint doped with AlN nanoparticles

A novel Ag paste containing chestnut-burr-like microscale Ag particles and AlN nanoparticles was developed to meet the requirements of power modules on the reliable packaging materials. The joints sintered by this hybrid Ag paste showed a high average shear strength of 54.0 MPa owing to the low porosity of bondline. The addition of the AlN nanoparticles also suppressed the pore growth during thermal aging at 300 & DEG;C, ensuring a high reliability with minimal increase in porosity and decrease in strength. After 1008 h thermal aging, the average shear strength of joints sintered by the hybrid Ag paste still reached to 36.4 MPa.

Automated summary

A novel Ag paste containing chestnut-burr-like microscale Ag particles and AlN nanoparticles was developed for power module packaging materials. The joints sintered with this paste showed a high average shear strength of 54.0 MPa due to low porosity. The addition of AlN nanoparticles suppressed pore growth during thermal aging and maintained high reliability with minimal porosity increase and strength decrease. After 1008 h of aging, the joints still had an average shear strength of 36.4 MPa.