Cu aggregation behavior on interfacial reaction of Sn-3.0Ag-0.5Cu/ENIG solder joints

Cu aggregation of Sn-3.0Ag-0.5Cu /electroless nickel-immersion gold (ENIG) solder joints generally affect the formation of intermetallic compounds (IMCs) at the interfacial region. Herein, the interfacial microstructure of Sn-3.0Ag-0.5Cu/ENIG solder joint is compared with the joints obtained with Cu-free solder or substrate to reveal the Cu contributor and its metallurgical behavior. Scanning Electron Microscope (SEM) and Energy Dispersive Spectroscopy (EDS) were used to observe the IMCs and elemental distribution, respectively. The Gibbs free energy of the Sn-Ni-Cu system was calculated by JMatPro software. The results showed that Cu had significant aggregation in the interface. The solder is the major contributor to Cu aggregation in the interface, while the ENIG substrate also makes a minor contribution. The Cu6Sn5 is then formed at the interface because of its lowest Gibbs free energy in the system. These results are of significance for subsequently controlling the interfacial microstructure and performance of joints.

Automated summary

The Cu aggregation in Sn-3.0Ag-0.5Cu/electroless nickel-immersion gold (ENIG) solder joints has a significant impact on the formation of intermetallic compounds (IMCs) at the interface. The study compared the interfacial microstructure of Sn-3.0Ag-0.5Cu/ENIG joints with Cu-free solder or substrate to determine the contribution of Cu and its metallurgical behavior. Scanning Electron Microscope (SEM) and Energy Dispersive Spectroscopy (EDS) were used to observe IMCs and elemental distribution. The results revealed that Cu aggregation occurred in the interface and was mainly contributed by the solder, while the ENIG substrate played a minor role. Cu6Sn5 was formed at the interface due to its lowest Gibbs free energy. These findings are important for controlling the interfacial microstructure and performance of solder joints.