4.5 Article

Compressive failure mechanism of sintered nano-silver

Related references

Note: Only part of the references are listed.
Review Nanoscience & Nanotechnology

Patterning of Metal Nanowire Networks: Methods and Applications

Qijin Huang et al.

Summary: Metal nanowires, especially silver nanowires, have been recognized as promising candidate materials for flexible and stretchable electronics due to their high electrical conductivity and ability to maintain electrical conductivity under deformation. Precise patterning of metal nanowire networks is crucial for high-performance electronic devices and remains a critical challenge in the field.

ACS APPLIED MATERIALS & INTERFACES (2021)

Article Engineering, Multidisciplinary

Thermo-elasto-plastic phase-field modelling of mechanical behaviours of sintered nano-silver with randomly distributed micro-pores

Yutai Su et al.

Summary: A novel computational framework was proposed to generate random micro-porous structures and simulate the mechanical properties and fracture behavior of sintered nano-silver paste. The model results showed good agreement with experimental results, providing an efficient and reliable approach to study the performance of nano-silver paste.

COMPUTER METHODS IN APPLIED MECHANICS AND ENGINEERING (2021)

Article Chemistry, Physical

Size effect on the fracture of sintered porous nano-silver joints: Experiments and Weibull analysis

Gong He et al.

Summary: The study investigated the effects of sintering temperature and cross section area on the mechanical properties of nano-silver joints, discussed the influence of volatilization and combustion of organic solvent on void formation in solder joints, and examined the size effect caused by different cross section areas.

JOURNAL OF ALLOYS AND COMPOUNDS (2021)

Article Chemistry, Physical

Sintering mechanism of Ag-Pd nanoalloy film for power electronic packaging

Qiang Jia et al.

Summary: This study successfully prepared a new material with high shear strength and excellent resistance to silver ionic migration by utilizing Ag-Pd nanoalloy as the die attach material. The research revealed the sintering mechanism of the alloy and confirmed the high reliability of Ag-Pd nanoalloy for low temperature bonding.

APPLIED SURFACE SCIENCE (2021)

Review Chemistry, Physical

Comparing the mechanical and thermal-electrical properties of sintered copper (Cu) and sintered silver (Ag) joints

Tiam Foo Chen et al.

Summary: This review compares the mechanical and thermal-electrical properties of sintered copper (Cu) with sintered silver (Ag) as bonding materials in microelectronics joint applications. It discusses the challenges of oxidation faced by sintered Cu throughout its product lifecycle and explores various sintering conditions and metallization/treatments to form reliable joints. The review also highlights the similarities in development between sintered Cu and sintered Ag based on patent information.

JOURNAL OF ALLOYS AND COMPOUNDS (2021)

Article Materials Science, Multidisciplinary

Creep of sintered porous micron-silver: nanoindentation experiment and theoretical analysis

Gong He et al.

Summary: The study found that the particle size in the silver paste affects the sintering quality and mechanical properties of sintered nano/micron-silver materials, with smaller silver particle size leading to better sintered effect. A micro-creep model incorporating damage was developed based on entropy theory and continuous damage mechanics, accurately predicting micro-creep compared with experimental results.

JOURNAL OF MATERIALS SCIENCE (2021)

Article Nanoscience & Nanotechnology

Maximum shear stress-controlled uniaxial tensile deformation and fracture mechanisms and constitutive relations of Sn-Pb eutectic alloy at cryogenic temperatures

Xiaoliang Ji et al.

Summary: This study comprehensively investigated the deformation and fracture behaviors, as well as the constitutive relations of Sn-Pb eutectic alloy at cryogenic temperatures through a series of experiments and analyses. The optimal combination of strength, ductility, and toughness was found at 123K for the alloy. Different fracture modes were observed under shear and normal stresses at various temperatures.

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING (2021)

Article Materials Science, Multidisciplinary

Strain rate shift for constitutive behaviour of sintered silver nanoparticles under nanoindentation

Xu Long et al.

Summary: This study investigates the stress-strain relationships of silver nanoparticles reinforced by SiC particles at different strain rates using nanoindentation technique, aiming to bridge the strain rate gap between nanoindentation and uniaxial tests. The proposed rate factors enable the evaluation of constitutive responses of sintered AgNP materials at different uniaxial strain rates, demonstrating the advantages of assessing the strain rate sensitivity using a Berkovich indenter.

MECHANICS OF MATERIALS (2021)

Article Nanoscience & Nanotechnology

Sintering Mechanism of a Supersaturated Ag-Cu Nanoalloy Film for Power Electronic Packaging

Qiang Jia et al.

ACS APPLIED MATERIALS & INTERFACES (2020)

Article Materials Science, Multidisciplinary

Study on the main influencing factors of shear strength of nano-silver joints

Hui Yang et al.

JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T (2020)

Article Engineering, Electrical & Electronic

Corrosion effects on sintered nano-silver joints and the secondary biological hazards

He Gong et al.

JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS (2020)

Article Materials Science, Multidisciplinary

Effects of Ni modified MWCNTs on the microstructural evolution and shear strength of Sn-3.0Ag-0.5Cu composite solder joints

Haozhong Wang et al.

MATERIALS CHARACTERIZATION (2020)

Article Nanoscience & Nanotechnology

Effect of Co addition into Ni film on shear strength of solder/Ni/Cu system: Experimental and theoretical investigations

Xiaoyang Bi et al.

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING (2020)

Article Materials Science, Multidisciplinary

Effects of porosity and pore microstructure on the mechanical behavior of nanoporous silver

Yao Yao et al.

MATERIALS TODAY COMMUNICATIONS (2020)

Article Chemistry, Physical

Low-temperature and pressureless sinter joining of Cu with micron/submicron Ag particle paste in air

Zheng Zhang et al.

JOURNAL OF ALLOYS AND COMPOUNDS (2019)

Article Engineering, Mechanical

Correlation of microstructure and constitutive behaviour of sintered silver particles via nanoindentation

Xu Long et al.

INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES (2019)

Article Materials Science, Multidisciplinary

Microstructure and mechanical properties of sintered Ag particles with flake and spherical shape from nano to micro size

Chuantong Chen et al.

MATERIALS & DESIGN (2019)

Review Chemistry, Multidisciplinary

Printable Transparent Conductive Films for Flexible Electronics

Dongdong Li et al.

ADVANCED MATERIALS (2018)

Article Nanoscience & Nanotechnology

Bonding technology based on solid porous Ag for large area chips

Chuantong Chen et al.

SCRIPTA MATERIALIA (2018)

Article Materials Science, Multidisciplinary

Macroscale and microscale fracture toughness of microporous sintered Ag for applications in power electronic devices

Chuantong Chen et al.

ACTA MATERIALIA (2017)

Article Chemistry, Multidisciplinary

3D Printing of Conductive Complex Structures with In Situ Generation of Silver Nanoparticles

Erika Fantino et al.

ADVANCED MATERIALS (2016)

Article Nanoscience & Nanotechnology

Microstructure evolution and shear fracture behavior of aged Sn3Ag0. 5Cu/Cu solder joints

Xiaowu Hu et al.

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING (2016)

Proceedings Paper Engineering, Mechanical

Damage model calibration and application for S355 steel

Joao Ribeiro et al.

21ST EUROPEAN CONFERENCE ON FRACTURE, (ECF21) (2016)

Review Nanoscience & Nanotechnology

Joining of Silver Nanomaterials at Low Temperatures: Processes, Properties, and Applications

Peng Peng et al.

ACS APPLIED MATERIALS & INTERFACES (2015)

Article Engineering, Industrial

Quantitative characterization of porosity and determination of elastic modulus for sintered micro-silver joints

James Carr et al.

JOURNAL OF MATERIALS PROCESSING TECHNOLOGY (2015)

Article Materials Science, Multidisciplinary

Applying viscoplastic constitutive models to predict ratcheting behavior of sintered nanosilver lap-shear joint

Gang Chen et al.

MECHANICS OF MATERIALS (2014)

Article Materials Science, Multidisciplinary

The mechanical behavior of porous metal fiber sintered sheets

M. Z. Jin et al.

JOURNAL OF THE MECHANICS AND PHYSICS OF SOLIDS (2013)

Article Materials Science, Multidisciplinary

A micromechanics elastic-plastic constitutive model for sintered stainless steel fiber felt

Peiyun Yi et al.

MATERIALS & DESIGN (2013)

Article Engineering, Chemical

Effect of joint sizes of low-temperature sintered nano-silver on thermal residual curvature of sandwiched assembly

Yunhui Mei et al.

INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES (2012)

Review Chemistry, Physical

Mechanical properties of nano-silver joints as die attach materials

Kim S. Siow

JOURNAL OF ALLOYS AND COMPOUNDS (2012)

Article Materials Science, Multidisciplinary

Applying Anand model to low-temperature sintered nanoscale silver paste chip attachment

Dun-ji Yu et al.

MATERIALS & DESIGN (2009)