Additive-induced crystallization of highly (111) textured Cu nanotwins by electroless deposition

High-density Cu nanotwins in columnar grains were successfully fabricated within an electroless-deposited Cu film using a formaldehyde-based electroless plating solution. Such a structure was achieved by using a standard electroless plating process without high-speed stirring. Additives within the plating bath induced the crystallization of the nanotwinned structure in the reduced Cu atoms. In addition, the deposited Cu nanotwins comprised as high as 87% of the (111) textured orientation. The characteristics of the (111)-oriented Cu nanotwins and the advantages of the electroless deposition process indicate that this method is promising for future applications in the electronics industry. (c) 2023 Elsevier B.V. All rights reserved.

Automated summary

High-density Cu nanotwins in columnar grains were successfully fabricated using a formaldehyde-based electroless plating solution. Additives induced the crystallization of the nanotwinned structure, and the deposited Cu nanotwins had a high percentage of (111) textured orientation. The characteristics of the (111)-oriented Cu nanotwins and the advantages of the electroless deposition process make this method promising for future applications in the electronics industry.