Journal
JOURNAL OF ALLOYS AND COMPOUNDS
Volume 960, Issue -, Pages -Publisher
ELSEVIER SCIENCE SA
DOI: 10.1016/j.jallcom.2023.170859
Keywords
Freeze-casting; Copper matrix composite; Electrical conductivity; Mechanical properties
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In this paper, copper-tungsten composites were synthesized by preparing porous tungsten skeletons through directional solidification, ice sublimation, and heat treatment, followed by infiltration of copper. The Cu-15 vol% W composites exhibited alternately patterned Cu and W microstructures and showed a good combination of electrical conductivity and hardness. The strengthening mechanisms were attributed to the tungsten network structures formed in the copper matrix.
Copper-tungsten (Cu-W) composites with a copper content larger than 50 vol% are expected to have a good combination of electrical conductivity and mechanical properties. However, it is difficult to synthesize these types of composites using the conventional manufacturing routes. In this paper, W skeletons with a high porosity up to 80 & PLUSMN; 0.8% and well-aligned microstructures were prepared by directional solidification of aqueous slurries of W followed by ice sublimation and heat treatment. Tungsten reinforced copper matrix composites (e.g., Cu-15 vol% W composites) were fabricated by infiltration of Cu into the W skeleton structures, and their microstructure, electrical conductivity and mechanical properties were studied. The synthesized Cu-15 vol% W composites exhibited alternately patterned Cu and W microstructures and showed a good combination of electrical conductivity of 78 & PLUSMN; 2% IACS and hardness of 136 & PLUSMN; 6HV. The strengthening mechanisms of these Cu-15 vol% W composites were identified as the formation of tungsten network structures which support and strengthen the copper matrix. Residual pores in the W lamellae and weak interfaces of copper-tungsten caused the initiation and propagation of cracks, and the fracture mode of Cu-15 vol% W composite was polymerization induced ductile fracture. & COPY; 2023 Elsevier B.V. All rights reserved.
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