4.4 Article

Automated Visual Inspection of Defects in Transparent Display Layers Using Light-Field 3-D Imaging

Journal

IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING
Volume 36, Issue 3, Pages 486-493

Publisher

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TSM.2023.3280897

Keywords

Light-field imaging; visual inspection; defect localization; defect type classification

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In this work, a novel visual inspection method using light-field 3D imaging is proposed to detect defects on a display panel. By acquiring high-resolution depth information of defects located inside transparent layers without powering the panel, the physical locations of defects can be estimated. The types of defects and their layer locations can be automatically classified along the depth axis in multiple transparent layers. Experimental results validate the successful detection and classification of various display defects.
Since a display panel comprises multiple layered components, defects may occur within different layers through manufacturing processes. Traditional visual inspection systems with a 2D camera cannot identify the occurrence location among layers. Several 3D imaging technologies, such as CT, TSOM, and MRI, suffer from slow performance and a large form factor. In this work, we propose a novel visual inspection method to detect defects on a display panel using light-field 3D imaging. Without powering the target display panel, we first acquire the high-resolution depth information of defects located inside the transparent layers. We then convert the depth information to the object coordinate system to estimate the physical locations of defects. We automatically classify the types of defects and their layer locations along the depth axis in multiple transparent layers of the display panel. Lastly, our experimental results validate that our method can successfully detect and classify various display defects.

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