Effect of sulfide on de-passivation and re-passivation of copper in borate buffer solution

The interaction of copper with sulfide-containing borate buffer solution either via direct immersion or by depassivation following oxide film formation, is studied by electrochemical techniques (voltammetry, currenttime transients and electrochemical impedance spectroscopy, EIS) complemented with surface and crosssectional microscopic observations and energy dispersive spectroscopic analyses. Both experimental findings and quantitative interpretation of EIS data using newly developed and previously published kinetic models indicate that no continuous adherent barrier-type layer is formed on Cu in sulfide solutions, thus precluding the possibility of the development of localized corrosion modes.

Automated summary

The interaction between copper and sulfide-containing borate buffer solution was studied using electrochemical techniques, microscopic observations, and spectroscopic analyses. The results showed that no continuous adherent barrier layer was formed on the copper surface in sulfide solutions, indicating the absence of localized corrosion modes.