Related references
Note: Only part of the references are listed.Control of the Micro-Defects on the Surface of Silicon Wafer in Chemical Mechanical Polishing
Qun Zhao et al.
ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY (2022)
An experimental investigation of silicon wafer thinning by sequentially using constant-pressure diamond grinding and fixed-abrasive chemical mechanical polishing
Gengzhuo Li et al.
JOURNAL OF MATERIALS PROCESSING TECHNOLOGY (2022)
Surface action mechanism and design considerations for the mechanical integrity of cu/low K BEOL interconnect during chemical mechanical polishing process
Shizhao Wang et al.
MICROELECTRONICS RELIABILITY (2022)
Modeling the microscale contact status in chemical mechanical polishing process
Lin Wang et al.
INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES (2022)
Effect and Mechanism of Dual-Official Group of Ethanolamines on the Chemical Mechanical Polishing of Monocrystalline Silicon
Xinying Zhang et al.
ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY (2022)
The Road for 2D Semiconductors in the Silicon Age (Adv. Mater. 48/2022)
Shuiyuan Wang et al.
ADVANCED MATERIALS (2022)
Surface Morphology Evolution during Chemical Mechanical Polishing Based on Microscale Material Removal Modeling for Monocrystalline Silicon
Jingjing Xia et al.
MATERIALS (2022)
Atomic-Level Material Removal Mechanisms of Si(110) Chemical Mechanical Polishing: Insights from ReaxFF Reactive Molecular Dynamics Simulations
Ming Wang et al.
LANGMUIR (2021)
Improving Junction Quality via Modifying the Si Surface to Enhance the Performance of PEDOT:PSS/Si Hybrid Solar Cells
Ting Gao et al.
ACS APPLIED ENERGY MATERIALS (2021)
Micro-scale contact behavior and its effect on the material removal process during chemical mechanical polishing
Lin Wang et al.
TRIBOLOGY INTERNATIONAL (2021)
Synergy between dodecylbenzenesulfonic acid and isomeric alcohol polyoxyethylene ether for nano-scale scratch reduction in copper chemical mechanical polishing
Chong Luo et al.
TRIBOLOGY INTERNATIONAL (2020)
Surface action mechanism and planarization effect of sarcosine as an auxiliary complexing agent in copper film chemical mechanical polishing
Jiakai Zhou et al.
APPLIED SURFACE SCIENCE (2020)
Environment friendly chemical mechanical polishing of copper
Zhenyu Zhang et al.
APPLIED SURFACE SCIENCE (2019)
Surface Characterization of Colloidal Silica Nanoparticles by Second Harmonic Scattering: Quantifying the Surface Potential and Interfacial Water Order
Arianna Marchioro et al.
JOURNAL OF PHYSICAL CHEMISTRY C (2019)
Graphene and two-dimensional materials for silicon technology
Deji Akinwande et al.
NATURE (2019)
Improvement in polishing effect of silicon wafer due to low-amplitude megasonic vibration assisting chemical-mechanical polishing
Liang Li et al.
JOURNAL OF MATERIALS PROCESSING TECHNOLOGY (2019)
Zeta potential and viscosity of colloidal silica suspensions: Effect of seawater salts, pH, flocculant, and shear rate
Cristian P. Romero et al.
COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS (2018)
Theoretical model and experimental analysis of chemical mechanical polishing with the effect of slurry for abrasive removal depth and surface morphology of silicon wafer
Zone-Ching Lin et al.
TRIBOLOGY INTERNATIONAL (2018)
Nanomanufacturing of silicon surface with a single atomic layer precision via mechanochemical reactions
Lei Chen et al.
NATURE COMMUNICATIONS (2018)
Study on chemical mechanical polishing of silicon wafer with megasonic vibration assisted
Zhai Ke et al.
ULTRASONICS (2017)
Chemical Mechanical Polishing (CMP) Processes for Manufacturing Optical Silicon Substrates with Shortened Polishing Time
Z. W. Zhong et al.
MATERIALS AND MANUFACTURING PROCESSES (2013)
The use of potassium peroxidisulphate and Oxone® as oxidizers for the chemical mechanical polishing of silicon wafers
A. Pineiro et al.
WEAR (2013)
Scratch formation and its mechanism in chemical mechanical planarization (CMP)
Tae-Young Kwon et al.
FRICTION (2013)
Preparation of PS Colloids with DMA and MMA Comonomers and Suitability of P(S/DMA) for Colloidal Silica Deposition
R. Bengu Karabacak et al.
JOURNAL OF MACROMOLECULAR SCIENCE PART A-PURE AND APPLIED CHEMISTRY (2012)
Preparation of silane modified SiO2 abrasive particles and their Chemical Mechanical Polishing (CMP) performances
GuoShun Pan et al.
WEAR (2011)
Role of amines and amino acids in enhancing the removal rates of undoped and P-doped polysilicon films during chemical mechanical polishing
P. R. Veera Dandu et al.
COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS (2010)
Effect of alkaline agent in colloidal silica slurry for polycrystalline silicon chemical mechanical polishing
Myung-Yoon Lee et al.
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS (2007)
Accurate pKa determinations for some organic acids using an extended cluster method
Zhao-kun Jia et al.
CHEMICAL PHYSICS LETTERS (2007)