Journal
APPLIED PHYSICS LETTERS
Volume 123, Issue 13, Pages -Publisher
AIP Publishing
DOI: 10.1063/5.0160802
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The study investigates the effects of rapid thermal annealing on the structure and photoluminescence of PbSe thin films grown on GaAs (001) at low temperatures. It is found that annealing leads to extensive re-crystallization and transformation of grain boundaries, resulting in improved photoluminescence properties. This research is important for the integration of PbSe infrared optoelectronics at low temperatures.
We investigate the beneficial effects of rapid thermal annealing on structure and photoluminescence of PbSe thin films on GaAs (001) grown below 150 C-degrees, with a goal of low temperature integration for infrared optoelectronics. Thin films of PbSe deposited on GaAs by molecular beam epitaxy are epitaxial at these reduced growth temperatures, yet the films are highly defective with a mosaic grain structure with low angle and dendritic boundaries following coalescence. Remarkably, we find that rapid thermal annealing for as short as 180 s at temperatures between 300 and 425 C-degrees in nitrogen ambient leads to extensive re-crystallization and transformation of these grain boundaries. The annealing at the same time dramatically improves the band edge luminescence at 3.7 mu m from previously undetectable levels to nearly half as intense as our best conventionally grown PbSe films at 300 C-degrees. We show using an analysis of laser pump-power dependent photoluminescence measurements that this dramatic improvement in the photoluminescence intensity is due to a reduction in the trap-assisted recombination. However, we find it much less correlated with improved structural parameters determined by x-ray diffraction rocking curves, thereby pointing to the importance of eliminating point defects over extended defects. Overall, the success of rapid thermal annealing in improving the luminescent properties of low growth temperature PbSe is a step toward the integration of PbSe infrared optoelectronics in low thermal budget, back end of line compatible fabrication processes.
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