Co-deposition and thermal conductivity of nickel-graphene composite coatings on copper surface

Galvanostatic electrochemical co-deposition was used to fabricate nickel-based reduced graphene oxide (Ni-rGO) nanocomposite by varying the current density in the range of 3-6 Adm-2 and at rGO loading of 1 g L-1. The process relies on the reduction of oxygenated functional groups of GO. By excessive incorporation and simultaneous reduction of GO in the structure of Ni-rGO composite coatings, the morphology transforms into structure with rough and three-dimensional (3D) features. The formation of Ni-rGO composite coatings was confirmed by investigating 3D morphology by SEM and XRD studies. Furthermore, comprehensive investigation of the thermal diffusivity, density, specific heat capacity, and thermal conductivity of Ni-rGO composite was conducted. Moreover, the relationship between current density and thermal conductivity was also evaluated. The test results indicate that the prepared Ni-rGO composite exhibits excellent thermal conductivity when the current density is 5 A dm-2. Combined with the outstanding performance of corrosion resistance in the early stages, the as-prepared Ni-rGO composite coatings are highly promising for cooling systems in ship and heat dissipation system in ocean electronic equipment.

Automated summary

Galvanostatic electrochemical co-deposition was used to fabricate nickel-based reduced graphene oxide (Ni-rGO) nanocomposite with varying current density and GO loading. The morphology of the composite was transformed into a rough and three-dimensional structure by excessive incorporation and reduction of GO. The formation of Ni-rGO composite coatings was confirmed by SEM and XRD analysis. Moreover, the thermal properties of the Ni-rGO composite were comprehensively investigated, and the relationship between current density and thermal conductivity was evaluated. The prepared Ni-rGO composite exhibited excellent thermal conductivity and corrosion resistance, making it highly promising for cooling systems in ships and heat dissipation systems in ocean electronic equipment.