On the implication of solute contents and grain boundaries on the Hall-Petch relationship of nanocrystalline Ni-W alloys

Nano-crystalline nickel-tungsten alloys are investigated in order to provide evidence of the contribution of the solute content (light elements and tungsten) and grain-boundaries on hardness. For this purpose, Ni-W alloys were elaborated by electrodeposition in an additive free citrate ammonium bath. The variation of electrodeposition conditions leads to W contents up to 18 at%, with a broad range of grain sizes (5-650 nm). The incorporation of light elements (H, O, C, N) depends on the deposition applied conditions and a progressive modification of the texture is observed with the following sequence: {110}, NT (Non-Textured) and {111} textures. We show that the Hall-Petch relationship for these alloys is influenced by the presence of light elements, the nature of the crystallographic texture and the grain boundaries character. The dependence of grain size on:flow stress is a direct consequence of the solute content (solute strengthening) and the evolution of the internal stresses with grain size. To explain the experimental data, two competing physical mechanisms are suggested: grain boundary shearing and dislocation emission at grain boundary, which are affected by the nature of the grain boundary and the solute content.