Key Aspects of the Processes of Thermal Decomposition of Complex Compounds of Copper Formate for Low-Temperature Printed Electronics

This work is aimed at studying thefundamentals ensuring the formationof high-quality functional printed copper layers at low temperatures.The paper describes the decomposition of copper formate and its ligand-basedcomplexes: ammonia, ethylamine, diethylamine, and pyridine. Structuraland thermal features of the samples were studied by differential thermalanalysis, thermogravimetric analysis, and X-ray diffraction analysis.Based on the results of experimental data and quantum-chemical calculationsas well, the main features of the reactions of decomposition of thestudied samples have been proposed. Aspects of the main factors reducingthe decomposition temperature of complex compounds have been identifiedand described. Based on the results of the study, a self-consistentmodel which describes the limits of the existing models of the decompositionprocess of copper formate and its complex compounds is proposed inthe work.

Automated summary

This work focuses on studying the basics of forming high-quality functional printed copper layers at low temperatures. The decomposition process of copper formate and its ligand-based complexes (ammonia, ethylamine, diethylamine, and pyridine) is described, and the structural and thermal features of the samples are analyzed. The study proposes a self-consistent model that describes the limitations of existing models for the decomposition process of copper formate and its complex compounds.