Thermal Conductivity for p-(Bi, Sb)2Te3 Films of Topological Insulators

In this study, we investigated the temperature dependencies of the total, crystal lattice, and electronic thermal conductivities in films of topological insulators p-Bi0.5Sb1.5Te3 and p-Bi2Te3 formed by discrete and thermal evaporation methods. The largest decrease in the lattice thermal conductivity because of the scattering of long-wavelength phonons on the grain interfaces was observed in the films of the solid-solution p-Bi0.5Sb1.5Te3 deposited by discrete evaporation on the amorphous substrates of polyimide without thermal treatment. It was shown that in the p-Bi0.5Sb1.5Te3 films with low thermal conductivity, the energy dependence of the relaxation time is enhanced, which is specific to the topological insulators. The electronic thermal conductivity was determined by taking into account the effective scattering parameter in the relaxation time approximation versus energy in the Lorentz number calculations. A correlation was established between the thermal conductivity and the peculiarities of the morphology of the interlayer surface (0001) in the studied films. Additionally, the total k and the lattice k L thermal conductivities decrease, while the number of grains and the roughness of the surface (0001) increase in unannealed films compared to annealed ones. It was demonstrated that increasing the thermoelectric figure of merit ZT in the p-Bi0.5Sb1.5Te3 films formed by discrete evaporation on a polyimide substrate is determined by an increase in the effective scattering parameter in topological insulators due to enhancement in the energy dependence of the relaxation time.

Automated summary

In this study, the temperature dependencies of the total, crystal lattice, and electronic thermal conductivities in films of topological insulators were investigated. It was found that the lattice thermal conductivity decreased due to the scattering of long-wavelength phonons on the grain interfaces. The energy dependence of the relaxation time in films with low thermal conductivity was enhanced, which is specific to topological insulators. The thermal conductivity was correlated with the morphology of the interlayer surface (0001) in the studied films.