Low-loss interconnects for modular superconducting quantum processors

Low-loss superconducting aluminium cables and on-chip impedance transformers can be used to link qubit modules and create superconducting quantum computing networks with high-fidelity intermodule state transfer. Scaling is now a key challenge in superconducting quantum computing. One solution is to build modular systems in which smaller-scale quantum modules are individually constructed and calibrated and then assembled into a larger architecture. This, however, requires the development of suitable interconnects. Here we report low-loss interconnects based on pure aluminium coaxial cables and on-chip impedance transformers featuring quality factors of up to 8.1 x 10(5), which is comparable with the performance of our transmon qubits fabricated on a single-crystal sapphire substrate. We use these interconnects to link five quantum modules with intermodule quantum state transfer and Bell state fidelities of up to 99%. To benchmark the overall performance of the processor, we create maximally entangled, multiqubit Greenberger-Horne-Zeilinger states. The generated intermodule four-qubit Greenberger-Horne-Zeilinger state exhibits 92.0% fidelity. We also entangle up to 12 qubits in a Greenberger-Horne-Zeilinger state with 55.8 +/- 1.8% fidelity, which is above the genuine multipartite entanglement threshold of 1/2.

Automated summary

Low-loss superconducting aluminium cables and on-chip impedance transformers are used to connect qubit modules and create high-fidelity intermodule state transfer in superconducting quantum computing networks. Scaling is a key challenge in superconducting quantum computing, which can be addressed by building modular systems with suitable interconnects. The reported low-loss interconnects based on pure aluminium coaxial cables and on-chip impedance transformers demonstrate comparable performance with transmon qubits and enable intermodule quantum state transfer with high fidelity.