Related references
Note: Only part of the references are listed.Influence of Indium addition on microstructural and mechanical behavior of Sn solder alloys: Experiments and first principles calculations
Amey Luktuke et al.
ACTA MATERIALIA (2023)
Revealing effects of common nonmetallic impurities on the stability and strength of Cu-Sn solder joints: A first-principles investigation
Ancang Yang et al.
VACUUM (2022)
Effect of indium on microstructure, mechanical properties, phase stability and atomic diffusion of Sn-0.7Cu solder: Experiments and first-principles calculations
Ancang Yang et al.
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING (2022)
Tensile, hardness and microstructural properties of Sn-Pb solder alloys
Olayide R. Adetunji et al.
MATERIALS TODAY-PROCEEDINGS (2021)
Backside Metallization of Ag-Sn-Ag Multilayer Thin Films and Die Attach for Semiconductor Applications
Jinseok Choi et al.
JOURNAL OF ELECTRONIC MATERIALS (2020)
Effect of nickel metallization thickness on microstructure evolution and mechanical properties in Sn3.0Ag0.5Cu/Au/Ni/Cu solder joints
Yutao Lin et al.
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS (2020)
Investigation of the Effect of Temperature on the Properties of No-Clean Reflow Soldering Fluxes
Jeno Gacs et al.
JOURNAL OF ELECTRONIC MATERIALS (2020)
Effects of cooling rate and joint size on Sn grain features in Cu/Sn-3.5Ag/Cu solder joints
Z. Y. Chang et al.
MATERIALIA (2020)
Formation and Evolution of Cu-Sn Intermetallic Compounds in Ultrasonic-Assisted Soldering
Weiyuan Yu et al.
JOURNAL OF ELECTRONIC MATERIALS (2019)
Kinetics of Ni solid-state dissolution in Sn and Sn3.5Ag alloys
J. Y. Wang et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2019)
Wetting of Sn-Zn-Ga and Sn-Zn-Na Alloys on Al and Ni Substrate
Tomasz Gancarz et al.
JOURNAL OF ELECTRONIC MATERIALS (2018)
Enhancement of Sn-Bi-Ag Solder Joints with ENEPIG Surface Finish for Low-Temperature Interconnection
Kelvin P. L. Pun et al.
JOURNAL OF ELECTRONIC MATERIALS (2018)
Interfacial Reaction and IMC Growth of an Ultrasonically Soldered Cu/SAC305/Cu Structure during Isothermal Aging
Yulong Li et al.
MATERIALS (2018)
A review on the mechanisms of ultrasonic wedge-wedge bonding
Yangyang Long et al.
JOURNAL OF MATERIALS PROCESSING TECHNOLOGY (2017)
The dissolution and reprecipitation behavior of the AuSn4 intermetallic compound in a solder joint during liquid-state and solid-state reactions
Chien-Lung Liang et al.
JOURNAL OF MATERIALS SCIENCE (2017)
Effect of ultrasonic vibration time on the Cu/Sn-Ag-Cu/Cu joint soldered by low-power-high-frequency ultrasonic-assisted reflow soldering
Ai Ting Tan et al.
ULTRASONICS SONOCHEMISTRY (2017)
A Study on Flex-on-Fabric Interconnection Using Anisotropic Conductive Films and Ultrasonic Bonding Method
Seung-Yoon Jung et al.
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY (2017)
The Influence of Cu on Metastable NiSn4 in Sn-3.5Ag-xCu/ENIG Joints
S. A. Belyakov et al.
JOURNAL OF ELECTRONIC MATERIALS (2016)
Controlling Interfacial Reactions and Intermetallic Compound Growth at the Interface of a Lead-free Solder Joint with Layer-by-Layer Transferred Graphene
Yong-Ho Ko et al.
ACS APPLIED MATERIALS & INTERFACES (2016)
Wetting behaviour of SAC305 solder on different substrates in high vacuum and inert atmosphere
C. Goncalves et al.
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS (2015)
Effects of Microstructure and Loading on Fracture of Sn-3.8Ag-0.7Cu Joints on Cu Substrates with ENIG Surface Finish
Z. Huang et al.
JOURNAL OF ELECTRONIC MATERIALS (2014)
In-situ study on growth behavior of Ag3Sn in Sn-3.5Ag/Cu soldering reaction by synchrotron radiation real-time imaging technology
H. T. Ma et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2012)
Ultrasonic bonding for multi-chip packaging bonded with non-conductive film
Jong-Bum Lee et al.
MICROELECTRONIC ENGINEERING (2011)
Effects of ultrasonic bonding process on polymer-based anisotropic conductive film joints in chip-on-glass assemblies
Y. C. Lin et al.
POLYMER TESTING (2011)
Mechanisms of joint and microstructure formation in high power ultrasonic spot welding 6111 aluminium automotive sheet
D. Bakavos et al.
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING (2010)
Combined Thermodynamic-Kinetic Analysis of the Interfacial Reactions between Ni Metallization and Various Lead-Free Solders
Tomi Laurila et al.
MATERIALS (2009)
Reliability of lead-free solder joints with different PCB surface finishes under thermal cycling
Yanghua Xia et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2008)
Ultrasonic cavitation treatment for soldering on Zr-based bulk metallic glass
S. Tamura et al.
JOURNAL OF MATERIALS PROCESSING TECHNOLOGY (2008)
Effects of isothermal aging and temperature-humidity treatment of substrate on joint reliability of Sn-3.0Ag-0.5Cu/OSP-finished Cu CSP solder joint
Jeong-Won Yoon et al.
MICROELECTRONICS RELIABILITY (2008)
Comparative study of wetting behavior and mechanical properties (microhardness) of Sn-Zn and Sn-Pb solders
Rashed Adnan Islam et al.
MICROELECTRONICS JOURNAL (2006)
Share Paper
