Quasi in-situ observation of Ni-plated solder from various fracture mechanism using EBSD

In this study, Electron Backscattered Diffraction (EBSD) was used to investigate the blocking effect of novel electroplated Ni in order to inhibit the growth of IMC layers in high density packaging technology. The diffusion of interfacial elements was analyzed as the main cause for compound growth after high temperature storage. The grain orientation tends to be consistent and the grain size increased with increasing time. And the blocking effect of Ni was calculated from the atomic diffusion level. Moreover, the mechanical properties showed an increasing and then decreasing change with time. In nanopush ball experiments, we observed three fracture modes. The fracture type shifted from Type I to Type II to Type III due to the increase of IMC thickness and the generation of Cu6Sn5.(c) 2023 The Authors. Published by Elsevier B.V. This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/).

Automated summary

In this study, the blocking effect of electroplated Ni was investigated using EBSD to inhibit the growth of IMC layers in high density packaging technology. The diffusion of interfacial elements was found to be the main cause of compound growth after high temperature storage. The grain orientation tended to be consistent and the grain size increased with time. The blocking effect of Ni was calculated from the atomic diffusion level. Moreover, the mechanical properties showed an increasing and then decreasing trend over time. Three fracture modes were observed in nanopush ball experiments, with the fracture type shifting as the IMC thickness increased and Cu6Sn5 was generated.