Journal
OPTICA
Volume 10, Issue 6, Pages 774-782Publisher
Optica Publishing Group
DOI: 10.1364/OPTICA.486746
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In the last two decades, ultrafast in-volume laser-based processing of transparent materials has become a key 3D-printing method. However, determining suitable laser process parameters for a given substrate is still a time-consuming task. This study introduces a method using in situ full-field third-harmonic generation (THG) microscopy to quickly identify the entire processing space and extract incubation laws governing the laser exposure process, enabling accelerated implementations of laser processes and closed-loop process control.
During the last two decades, ultrafast in-volume laser-based processing of transparent materials has emerged as a key 3D-printing method for manufacturing a variety of complex integrated photonic devices and micro-parts. Yet, identifying suitable laser process parameters for a given substrate remains a tedious, time-consuming task. Using a single laser source for both processing and monitoring, we demonstrate a method based on in situ full-field third-harmonic generation(THG) microscopy that exploits the properties of a low-noiseCMOSimager to rapidly identify the entire processing space, discriminating different types of laser-induced modifications, and extracting incubation laws governing the laser exposure process. Furthermore, we show that full-field THG monitoring is capable of identifying parameters leading to enhanced functional properties, such as laser-enhanced etching selectivity. These findings enable accelerated implementations of laser processes of arbitrarily chosen transparent materials and, due to the rapid acquisition time (>100 FPS) of the imager, closed-loop process control. (c) 2023 Optica Publishing Group under the terms of the Optica Open Access Publishing Agreement
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