Multi-Level Resistive Al/Ga2O3/ITO Switching Devices with Interlayers of Graphene Oxide for Neuromorphic Computing

Recently, resistive random access memory (RRAM) has been an outstanding candidate among various emerging nonvolatile memories for high-density storage and in-memory computing applications. However, traditional RRAM, which accommodates two states depending on applied voltage, cannot meet the high density requirement in the era of big data. Many research groups have demonstrated that RRAM possesses the potential for multi-level cells, which would overcome demands related to mass storage. Among numerous semiconductor materials, gallium oxide (a fourth-generation semiconductor material) is applied in the fields of optoelectronics, high-power resistive switching devices, and so on, due to its excellent transparent material properties and wide bandgap. In this study, we successfully demonstrate that Al/graphene oxide (GO)/Ga2O3/ITO RRAM has the potential to achieve two-bit storage. Compared to its single-layer counterpart, the bilayer structure has excellent electrical properties and stable reliability. The endurance characteristics could be enhanced above 100 switching cycles with an ON/OFF ratio of over 10(3). Moreover, the filament models are also described in this thesis to clarify the transport mechanisms.

Automated summary

Recently, resistive random access memory (RRAM) has emerged as a promising solution for high-density storage and in-memory computing applications. However, traditional RRAM's two-state accommodation cannot meet the high density requirement in the era of big data. This study demonstrates that Al/graphene oxide (GO)/Ga2O3/ITO RRAM has the potential for achieving two-bit storage with improved electrical properties and stable reliability.