Interfacial Characterization and Thermal Conductivity of Diamond/Cu Composites Prepared by Liquid-Solid Separation Technique

Diamond/Cu composites are widely studied as a new generation of thermal management materials in the field of electronic packaging and heat sink materials. The surface modification of diamond can improve interfacial bonding between the diamond and Cu matrix. The Ti-coated diamond/Cu composites are prepared via an independently developed liquid-solid separation (LSS) technology. It is worth noting that there are obvious differences for the surface roughness between the diamond-{100} and -{111} face by AFM analysis, which may be related to the surface energy of different facets. In this work, the formation of titanium carbide (TiC) phase makes up the chemical incompatibility between the diamond and copper, and the thermal conductivities of 40 vol.% Ti-coated diamond/Cu composites can be improved to reach 457.22 W center dot m(-1)center dot K-1. The results estimated by the differential effective medium (DEM) model illustrate that the thermal conductivity for 40 vol.% Ti-coated diamond/Cu composites show a dramatic decline with increasing TiC layer thickness, giving a critical value of similar to 260 nm.

Automated summary

Diamond/Cu composites with Ti-coating were prepared using a liquid-solid separation technology. The formation of TiC phase improved the interfacial bonding between diamond and copper, resulting in a thermal conductivity of 457.22 W·m(-1)·K-1 for 40 vol.% Ti-coated diamond/Cu composites. The thermal conductivity showed a significant decrease with increasing TiC layer thickness, reaching a critical value of approximately 260 nm, as estimated by the differential effective medium model.