Large-Area Flexible Thin Film Encapsulation with High Barrier and Super-Hydrophobic Property

With the development of optoelectronic devices toward miniaturization, flexibility, and large-scale integration, conventional submillimeter rigid encapsulation techniques rarely achieve conformational functionality while blocking water and oxygen. At the same time, the sensitivity of electronic devices with organic/metal/semiconductor components to humidity and oxygen severely impairs their operational stability and lifetime. Here, a nanometer to micrometer scale organic/inorganic hybrid thin film encapsulation (TFE) with the self-cleaning ability for flexible encapsulation is developed. The water vapor transmittance rate of polyethylene terephthalate substrate coated with the TFE is as low as 1.65 x 10(-4) g m(-2) day(-1), and the barrier improvement factor reaches 10(4) at 38 degrees C and 90% relative humidity. This value is equivalent to 9.81 x 10(-6) g m(-2) day(-1) at ambient conditions, sufficient to improve the lifetime of water-sensitive electronic devices. Meanwhile, this TFE shows a super-hydrophobic performance, with a water contact angle of 168.4 degrees. In addition, the resulting barrier films exhibit outstanding optical properties, with an average optical transmittance of 86.88% in the visible region. This versatile TFE can promote the development of optoelectronic devices toward miniaturization and large-scale integration in the future.

Automated summary

With the development of optoelectronic devices towards miniaturization and flexibility, conventional submillimeter rigid encapsulation techniques are inadequate. This study proposes a nanometer to micrometer scale organic/inorganic hybrid thin film encapsulation (TFE) with self-cleaning ability, low water vapor transmittance rate, and super-hydrophobic performance. The TFE shows excellent barrier improvement and optical properties, making it a promising solution for the development of optoelectronic devices.