Scalability of Large-Scale Photonic Integrated Circuits

To keep up with the growing bandwidth demands, photonic integrated circuits (PICs) have been widely employed in various application scenarios where high capacity and high-bandwidth density interconnects are required. However, it is challenging to scale the PICs toward future petabit per second capacity requirements. We study the scalability bottlenecks of PICs in terms of guiding materials, dense integration approaches, wide-band optical sources, and high efficiency tunable and modulation devices. We also look for possible solutions to address these challenges. In the end, we provide a perspective on future PIC development. Moore's law for integrated photonics may last for a much shorter time than that in the microelectronics industry, requiring significant innovations and technological breakthroughs in PIC research.

Automated summary

To meet the increasing demand for bandwidth, photonic integrated circuits (PICs) have been widely used in applications requiring high capacity and high-bandwidth density interconnects. However, scaling PICs to meet future petabit per second capacity requirements poses challenges. This study examines the scalability bottlenecks of PICs including guiding materials, dense integration approaches, wide-band optical sources, and high efficiency tunable and modulation devices. Potential solutions to address these challenges are explored. Future PIC development will require significant innovations and technological breakthroughs, as the Moore's law for integrated photonics may have a shorter lifespan compared to that in the microelectronics industry.