4.7 Article

Ultralarge Curvature Folding Resistance of Polyimide Films Based on Spring-Like Folding Segments

Journal

ACS MACRO LETTERS
Volume 12, Issue 6, Pages 703-709

Publisher

AMER CHEMICAL SOC
DOI: 10.1021/acsmacrolett.3c00123

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This study presents a strategy to develop foldable polyimide (PI) films with excellent dynamic and static folding resistance. The newly developed folding-chain PI (FPI) films show enhanced elastic behavior and can endure a large curvature without any crease. FPI-20 film, for example, can withstand over 200,000 folds with a folding radius of 0.5 mm, while pure PI film shows creases after only 1,000 folds. This research is of great significance for the development of lighter and thinner flexible electronics.
With the trend toward lighter andthinner flexible electronics,developing foldable polymeric substrates that can withstand ultralowfolding radiuses has become an urgent issue. Here, a strategy to developpolyimide (PI) films with excellent dynamic and static folding resistanceunder an ultralarge curvature through copolymerizing one unidirectionaldiamine with classic PMDA-ODA PIs to achieve a kind of folding-chainPI (FPI). It was theoretically and experimentally confirmed that thespring-like folding structure equipped PI films with an enhanced elasticbehavior and thus an excellent ability to endure a large curvature.Among them, FPI-20 did not show any crease even after folding over200000 times under a folding radius of 0.5 mm, while creases wereobserved on pure PI film only after folding 1000 times. It is noteworthythat the folding radius was almost 5 times smaller than that in currentreports (2-3 mm). Meanwhile, the spread angle of FPI-20 filmsafter static folding at 80 degrees C under a 0.5 mm folding radius get51% larger than that of films, showing the remarkable static foldingresistance.

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