Thermal decomposition investigation on heat-resistant poly (dimethylsilylene ethynylenemethylphenylene-methylenemethylphenyleneethynylene) resins

Thermal decomposition of heat resistant poly(dimethylsilylene ethynylenemethylphenylenemethylenemethyl-phenyleneethynylene) (PSMA) resins has been investigated by TGA, Py-GC-MS, and TGA-MS analysis tech-niques. The decomposition kinetics was studied with Kissinger-Akahira-Sunose method (KAS method). The results show that the decomposition of the cured PSMA resins is obviously influenced by the presence and lo-cations of the side methyl groups on the benzene rings and their decomposed fragments are different. The side methyl groups on benzene rings easily break down, which make the resins decompose at lower decomposition temperatures. The cleavage of the side methyl groups further induces the decomposition of the main chains of the resins and results in low residue yields. The decomposition mechanisms of the cured PSMA resins are suggested.

Automated summary

Thermal decomposition of heat resistant poly(dimethylsilylene ethynylenemethylphenylenemethylenemethyl-phenyleneethynylene) (PSMA) resins was investigated using TGA, Py-GC-MS, and TGA-MS analysis techniques. The decomposition kinetics was studied using the Kissinger-Akahira-Sunose method (KAS method). The results showed that the decomposition of the cured PSMA resins was influenced by the presence and locations of side methyl groups on the benzene rings, leading to different decomposed fragments. The breakdown of the side methyl groups resulted in lower decomposition temperatures and further decomposition of the main chains of the resins, resulting in low residue yields. The decomposition mechanisms of the cured PSMA resins were suggested.