Contactless Sensing of Water Properties for Smart Monitoring of Pipelines

A key milestone for the pervasive diffusion of wireless sensing nodes for smart monitoring of water quality and quantity in distribution networks is the simplification of the installation of sensors. To address this aspect, we demonstrate how two basic contactless sensors, such as piezoelectric transducers and strip electrodes (in a longitudinal interdigitated configuration to sense impedance inside and outside of the pipe with potential for impedimetric leak detection), can be easily clamped on plastic pipes to enable the measurement of multiple parameters without contact with the fluid and, thus, preserving the integrity of the pipe. Here we report the measurement of water flow rate (up to 24 m(3)/s) and temperature with ultrasounds and of the pipe filling fraction (capacitance at 1 MHz with similar to cm(3) resolution) and ionic conductivity (resistance at 20 MHz from 700 to 1400 mu S/cm) by means of impedance. The equivalent impedance model of the sensor is discussed in detail. Numerical finite-element simulations, carried out to optimize the sensing parameters such as the sensing frequency, confirm the lumped models and are matched by experimental results. In fact, a 6 m long, 30 L demonstration hydraulic loop was built to validate the sensors in realistic conditions (water speed of 1 m/s) monitoring a pipe segment of 0.45 m length and 90 mm diameter (one of the largest ever reported in the literature). Tradeoffs in sensors accuracy, deployment, and fabrication, for instance, adopting single-sided flexible PCBs as electrodes protected by Kapton on the external side and experimentally validated, are discussed as well.

Automated summary

To simplify the installation of sensors, we demonstrate the clamping of piezoelectric transducers and strip electrodes on plastic pipes for measurement of water flow rate, temperature, and impedance. Experimental results validate the sensors in realistic conditions, and tradeoffs in accuracy, deployment, and fabrication are discussed.