Decrypting the mechanisms of wicking and evaporation heat transfer on micro-pillars during the pool boiling of water using high-resolution infrared thermometry

Surfaces with micrometer-scale pillars have shown great potential in delaying the boiling crisis and enhancing the critical heat flux (CHF). However, physical mechanisms enabling this enhancement remain unclear. This knowledge gap is due to a lack of diagnostics that allow elucidating how micro-pillars affect thermal transport phenomena on the engineered surface. In this study, for the first time, we are able to measure time-dependent temperature and heat flux distributions on a boiling surface with engineered micro-pillars using infrared thermometry. Using these data, we reveal the presence of an intra-pillar liquid layer, created by the nucleation of bubbles and partially refilled by capillary effects. However, contrarily to conventional wisdom, the energy removed by the evaporation of this liquid cannot explain the observed CHF enhancement. Yet, predicting its dry out is the key to delaying the boiling crisis. We achieve this goal using simple analytic models and demonstrate that this process is driven by conduction effects in the boiling substrates and, importantly, in the intra-pillar liquid layer itself. Importantly, these effects also control the wicking flow rate and its penetration length. The boiling crisis occurs when, by coalescing, the size of the intra-pillar liquid layer becomes too large for the wicking flow to reach its innermost region. Our study reveals and quantifies unidentified physical aspects, key to the performance optimization of boiling surfaces for cooling applications.

Automated summary

Surfaces with micrometer-scale pillars have potential in delaying the boiling crisis and enhancing the critical heat flux. This study measures temperature and heat flux distributions on a boiling surface with engineered micro-pillars, revealing the presence of an intra-pillar liquid layer. The findings have important implications for optimizing boiling surfaces for cooling applications.