4.6 Article

Three-dimensional mode-division multiplexing system

Journal

OPTICS EXPRESS
Volume 31, Issue 11, Pages 18555-18566

Publisher

Optica Publishing Group
DOI: 10.1364/OE.488605

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The three-dimensional mode division multiplexing (MDM) technology can assemble simple devices in the 3D space to extend the data capacity of photonic integrated circuits. In this study, a 16x16 3D MDM system with a compact footprint was proposed, which can achieve 256 mode routes by converting input waveguide modes into desired output waveguide modes. The simulated results show low insertion losses and cross talk levels for the system. The 3D design architecture can be scaled to achieve arbitrary network complexity levels.
Blindly increasing the channels of the mode (de)multiplexer on the single-layer chip can cause the device structure to be too complex to optimize. The three-dimensional (3D) mode division multiplexing (MDM) technology is a potential solution to extend the data capacity of the photonic integrated circuit by assembling the simple devices in the 3D space. In our work, we propose a 16 x 16 3D MDM system with a compact footprint of about 100 & mu;m x 5.0 & mu;m x 3.7 & mu;m. It can realize 256 mode routes by converting the fundamental transverse electric (TE0) modes in arbitrary input waveguides into the expected modes in arbitrary output waveguides. To illustrate its mode-routing principle, the TE0 mode is launched in one of the sixteen input waveguides, and converted into corresponding modes in four output waveguides. The simulated results indicate that the ILs and CTs of the 16 x 16 3D MDM system are less than 3.5 dB and lower than -14.2 dB at 1550 nm, respectively. In principle, the 3D design architecture can be scaled to realize arbitrary network complexity levels. & COPY; 2023 Optica Publishing Group under the terms of the Optica Open Access Publishing Agreement

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