Journal
JOURNAL OF THERMAL ANALYSIS AND CALORIMETRY
Volume 125, Issue 3, Pages 1009-1015Publisher
SPRINGER
DOI: 10.1007/s10973-016-5482-y
Keywords
Ce-Sn alloy; DTA-TG-DTG; Oxidation; Lead-free solder
Funding
- Research and Development Operational Programme - European regional development fund [ITMS: 26220120048]
- Grant Agency VEGA [1/0068/14]
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Ce-Sn pre-alloy (master alloy) was designed for new lead-free solder alloy manufacturing. The microstructure characterization revealed the presence of CeSn3 particles in the Sn matrix. The melting behavior in air was investigated by differential thermal analysis coupled with thermogravimetric analysis. When melting was finished, the pre-alloy started to oxidize instantly, because of a high affinity between CeSn3 and Ce itself to oxygen. The oxidation process of Ce-Sn pre- alloy is described in detail. The solidus (231 degrees C) and liquidus (485 degrees C) temperatures of the alloy were determined by differential scanning calorimetry (DSC). By repetitive DSC measurement, it has been verified that this alloy had to be re-melted in an inert gas atmosphere to prevent oxidation. The master alloy is ultimately used to produce new Ce-containing Sn-Ag-Cu solder alloys.
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