Journal
JOURNAL OF THE TAIWAN INSTITUTE OF CHEMICAL ENGINEERS
Volume 60, Issue -, Pages 555-563Publisher
ELSEVIER SCIENCE BV
DOI: 10.1016/j.jtice.2015.10.024
Keywords
Ink-jet printing; N,N-dimethyl-dimethylaminoethyl methacrylate; Electroless Cu plating; PH-responsible Pd nanoparticle
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Funding
- National Science Council of the Republic of China, Taiwan [NSC 102-2622-E-606-001-CC2]
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We report on the preparation of a pH-sensitive styrene (St)-co-N,N-dimethyl-dimethylaminoethyl methacrylate (DMAEMA)/Pd ink for fabrication of copper pattern on a flexible PET substrate. The St-co-DMAEMA oligomers are synthesized via free radical polymerization using potassium persulfate as the initiator. The synthesized St-co-DMAEMA copolymer is utilized to self-reduce Pd nanoparticles. The pH-sensitive DMAEMA segments function as stabilizing agent for noble metal nanoparticles in acidic ink solution. On the other hand, ink-jet printing St-co-DMAEMA oligomers become hydrophobic during the electroless plating of copper with a basic bath. Therefore, a copper film with dramatically enhanced adhesion is formed on the PET surface without special pretreatment step before electroless deposition of copper film. This process yields Cu conductor formed by plating for 15 min on PET substrate with resistance 2.5 times that of bulk copper. The cyclic bending test results show that electrical resistance increases only slightly after 1000 cycles and is remained low enough for use in practical applications. (C) 2015 Taiwan Institute of Chemical Engineers. Published by Elsevier B.V. All rights reserved.
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