Nano-tribological behavior of CuCoCrFeNi high-entropy alloys at cryogenic temperature: A molecular dynamics study

High-entropy alloys exhibit great potential for cryogenic applications. This study investigates the nano-scratching behavior of CuCoCrFeNi high-entropy alloy at a cryogenic temperature (77 K) using molecular dynamics. Results show that compared with the single-grain model, the average friction coefficient (AFC) increases for all three polycrystalline models with different grain sizes d, but the anti-wear property can be improved by 28.5%, when grain size d = 10.7 nm. The smaller friction on the scratching surface of the single-grain model (AFC is 15.5% less than that of the model with d = 8.2 nm), which makes the overall temperature rise lower compared to that of the polycrystalline models. However, due to the stress concentration released when a complete stacking fault tetrahedron is produced, the single-grain model cannot significantly harden the surface and subsurface to a greater degree. In the polycrystalline models, dislocations are blocked at grain boundaries (GBs). However, the introduction of GBs changes the von Mises stress distribution. Finally, an attempt was made to reveal the role of yield pressure H-3/E-2 (H-hardness, E-elastic modulus) in friction-reducing and anti-wear properties.

Automated summary

High-entropy alloys show potential for cryogenic applications. This study investigates the nano-scratching behavior of a CuCoCrFeNi high-entropy alloy at a cryogenic temperature (77K) using molecular dynamics. Results show that the anti-wear property can be improved by 28.5% when the grain size is 10.7nm, but the overall temperature rise is lower in the single-grain model compared to the polycrystalline models due to smaller friction on the scratching surface.