Journal
JOURNAL OF THE MECHANICS AND PHYSICS OF SOLIDS
Volume 94, Issue -, Pages 191-206Publisher
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.jmps.2016.04.021
Keywords
Creep; Nanotwin; Activation parameters; HRTEM; Atomistic simulations
Funding
- General Research Fund from the Hong Kong Research Grants Council [622911]
- National Basic Research Program of China [2012CB937502]
- Research Grant from Science and Technology Commission of Shanghai Municipality [14DZ2261200]
- NSFC [11132011, 11402269, 11472287]
- National Key Basic Research Program of China [2012CB937500]
- CAS/SAFEA International Partnership Program for Creative Research Teams
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In the present work, we performed experiments, atomistic simulations, and high-resolution electron microscopy (HREM) to study the creep behaviors of the nanotwinned (nt) and nanograined (ng) copper at temperatures of 22 degrees C (RT), 40 degrees C, 50 degrees C, 60 degrees C, and 70 degrees C. The experimental data at various temperatures and different sustained stress levels provide sufficient information, which allows one to extract the deformation parameters reliably. The determined activation parameters and microscopic observations indicate transition of creep mechanisms with variation in stress level in the nt-Cu, i.e., from the Coble creep to the twin boundary (TB) migration and eventually to the perfect dislocation nucleation and activities. The experimental and simulation results imply that nanotwinfling could be an effective approach to enhance the creep resistance of twin-free ng-Cu. The experimental creep results further verify the newly developed formula (Yang et al., 2016) that describes the time-, stress-, and temperature-dependent plastic deformation in polycrystalline copper. (C) 2016 Elsevier Ltd. All rights reserved.
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