Related references
Note: Only part of the references are listed.Integrated Power Delivery Methodology for 3D ICs
Yousef Safari et al.
PROCEEDINGS OF THE TWENTY THIRD INTERNATIONAL SYMPOSIUM ON QUALITY ELECTRONIC DESIGN (ISQED 2022) (2022)
Power Delivery for High-Performance Microprocessors-Challenges, Solutions, and Future Trends
Kaladhar Radhakrishnan et al.
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY (2021)
Heterogeneous 3-D ICs as a platform for hybrid energy harvesting in IoT systems
Boris Vaisband et al.
FUTURE GENERATION COMPUTER SYSTEMS-THE INTERNATIONAL JOURNAL OF ESCIENCE (2018)
Architectural and Integration Options for 3D NAND Flash Memories
Rino Micheloni et al.
COMPUTERS (2017)
Modeling and Analysis of PDN Impedance and Switching Noise in TSV-Based 3-D Integration
Huanyu He et al.
IEEE TRANSACTIONS ON ELECTRON DEVICES (2015)
Novel Electrical and Fluidic Microbumps for Silicon Interposer and 3-D ICs
Li Zheng et al.
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY (2014)
Heterogeneous Methodology for Energy Efficient Distribution of On-Chip Power Supplies
Inna Vaisband et al.
IEEE TRANSACTIONS ON POWER ELECTRONICS (2013)
PDN Impedance Modeling and Analysis of 3D TSV IC by Using Proposed P/G TSV Array Model Based on Separated P/G TSV and Chip-PDN Models
Jun So Pak et al.
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY (2011)
Electrical Modeling and Characterization of Through Silicon via for Three-Dimensional ICs
Guruprasad Katti et al.
IEEE TRANSACTIONS ON ELECTRON DEVICES (2010)
Thermal-Aware Task Scheduling for 3D Multicore Processors
Xiuyi Zhou et al.
IEEE TRANSACTIONS ON PARALLEL AND DISTRIBUTED SYSTEMS (2010)
Effective radii of on-chip decoupling capacitors
Mikhail Popovich et al.
IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS (2008)
Processor design in 3D die-stacking technologies
Gabriel H. Loh et al.
IEEE MICRO (2007)
Evolution of materials technology for stacked-capacitors in 65 nm embedded-DRAM
E Gerritsen et al.
SOLID-STATE ELECTRONICS (2005)