Journal
IEEE TRANSACTIONS ON DIELECTRICS AND ELECTRICAL INSULATION
Volume 30, Issue 2, Pages 585-593Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TDEI.2022.3225696
Keywords
Plasmas; Couplings; Surface treatment; Optical fiber dispersion; Optical fiber devices; Insulation; Discharges (electric); Breakdown; coupling agent; meta-aramid paper; molecular dynamics (MD); plasma treatment
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In this article, a co-modification method of plasma discharge and coupling agent treatment for chopped fibers is proposed. Among three kinds of coupling agents, AP shows the best effect on improving the breakdown strength of the meta-aramid paper. The modified papers showed compact paper structures, reductions of electrical conductivity, and deepening of carrier trap curve.
The interface of fibers and fibrids is a key factor for the insulation strength of meta-aramid paper. In this article, a co-modification method of plasma discharge and coupling agent treatment for chopped fibers is proposed. By optimizing the plasma treating time, the surface hydroxyl groups are introduced to facilitate the grafting of coupling agents. Among three kinds of coupling agents, including amino-propyl-triethoxy-silane (AP), glycidyletheroxy-propyl-triethoxy-silane (GP), and mercapto-propyl-triethoxy-silane (MP), AP shows the best effect on improving the article breakdown strength, which reaches 28.3 kV/mm, 25% higher than the unmodified one. The modified papers showed compact paper structures, reductions of electrical conductivity, and deepening of carrier trap curve. Through the molecular dynamics (MD) simulation, we found that the coupling agent containing hydrogen bond (H-bond) donors rather than acceptors, namely AP, is easier to form new interface H-bonds with precipitated fibrids and does not consume intrinsic H-bonds with chopped fibers, and thus performs better on the fiber-fibrids interface interaction.
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