Journal
IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY
Volume 23, Issue 2, Pages 287-296Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TDMR.2023.3272928
Keywords
Wires; Multichip modules; Bonding; Substrates; Inductance; Heating systems; Integrated circuit interconnections; Power modules; packaging; double-sided; wireless; electric vehicles; automotive
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Power module packaging technologies are evolving to meet the compact high-power-density requirements. This article summarizes the thermal and electrical advantages of double-sided cooling power modules compared to wire-bonding. It also provides detailed introductions of typical double-sided cooling power modules developed by institutes or companies. The challenges and future trends of double-sided cooling power modules are highlighted.
Power module packaging technologies are undergoing extensive changes to satisfy compact high-power-density systems. The advantages of double-sided cooling power module in thermal and electrical compared to wire-bonding are summarized. Some typical double-sided cooling power modules developed by institutes or companies are introduced in detail. The challenges and future trends of double-sided cooling power modules are also highlighted.
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