☆ 4.7 Article

High-Tolerance Thin-Film Solder Joints for Electrical Interconnection in Harsh Environments

IEEE SENSORS JOURNAL (2023)

Related references

Note: Only part of the references are listed.

Article Chemistry, Multidisciplinary

Abnormal Graphitization Behavior in Near-Surface/Interface Region of Polymer-Derived Ceramics

Chao Wu et al.

Summary: This study investigates the phenomenon of the graphitization of free carbon in polymer-derived ceramics (PDCs) and uncovers the crucial role of surface/interface interactions in regulating carbon and its properties. Due to the enrichment behavior of free carbon in the near-surface/interface region, PDCs exhibit highly abnormal properties, such as the behavior of the current and the edge effect. These surface/interface interactions are of great significance for the applications of PDCs.

SMALL (2023)

Add to Collection

Article Materials Science, Characterization & Testing

Failure patterns of solder joints identified through lifetime vibration tests

Kangkana Baishya et al.

Summary: This paper investigates a non-destructive method for tracking the integrity of flip chip solder joints through life. Vibration tests were conducted on double-sided PCBs with different surface finishes to assess the failure patterns of solder joints. Results show distinct zones of crack initiation, propagation, and failure as the solder joints age.

NONDESTRUCTIVE TESTING AND EVALUATION (2023)

Add to Collection

Article Engineering, Environmental

Ultrafast high-temperature sintering of polymer-derived ceramic nanocomposites for high-temperature thin-film sensors

Chao Wu et al.

Summary: Polymer-derived ceramic nanocomposites (PDC-NCs) are promising materials for high-temperature thin-film sensor (TFS) applications. An ultrafast high-temperature sintering (UHS) method was employed to prepare PDC-NC TFSs in minutes. The TiB2/SiCNO film sintered by the UHS technique shows high-sensitive microstructure and properties to sintering parameters.

CHEMICAL ENGINEERING JOURNAL (2023)

Add to Collection

Article Materials Science, Multidisciplinary

Three-dimensional interface and property of SnPb solder joint under extreme thermal shocking

Jianhao Wang et al.

Summary: This study investigated the three-dimensional interfacial morphology and properties of eutectic SnPb solder joint under extreme thermal shocking conditions of 77-423 K to meet the cryogenic reliability requirements of electronic packaging for deep space satellites. The results showed that after thermal shocking, the Cu-Sn IMC layers coarsened and micro-cracks formed in the Cu6Sn5 layer. The rough Cu6Sn5 layer gradually smoothed in the top view, with broken Cu6Sn5 particles and exposed Cu3Sn. In the bottom-view observation, the Cu6Sn5 layer of the as-soldered joint was overlapped by the Cu3Sn layer. However, no defects were generated in the Cu3Sn layer. The shear force of the solder joint was greatly reduced due to the broken Cu6Sn5, with the fracture characteristics shifting from solder-controlled mode to solder/IMC mixed mode.

SCIENCE AND TECHNOLOGY OF WELDING AND JOINING (2022)

Add to Collection

Article Materials Science, Multidisciplinary

TiB2-Modified Polymer-Derived Ceramic SiCN Double-Layer Thin Films Fabricated by Direct Writing for High-Temperature Application

Chao Wu et al.

Summary: In this study, a TiB2-modified SiCN double-layer thin-film resistor with high thermal stability was fabricated and demonstrated excellent temperature stability and repeatability in thermal cycling tests. It can be used for in situ monitoring in high-temperature environments.

ADVANCED ENGINEERING MATERIALS (2022)

Add to Collection

Article Materials Science, Ceramics

Highly ordered columnar ITO thin film with enhanced thermoelectric and mechanical performance over wide temperature range

Bingwei Luo et al.

Summary: This study fabricated a thin-film thermocouple based on ITO with a low-crystallised highly ordered columnar structure, exhibiting good sensitivity and reliability over a wide temperature range. The electrical conductivity showed high-temperature-dependent sensitivity due to increasing density with temperature, and demonstrated excellent service reliability at high temperatures.

CERAMICS INTERNATIONAL (2022)

Add to Collection

Article Materials Science, Ceramics

TiB2-modified PDC electrical solder joints for electrical interconnection in extreme environments

Chao Wu et al.

Summary: In this study, TiB2-modified PDC electrical solder joints were developed for electrical interconnections in harsh environments, exhibiting extremely low resistance, reliable electrical connection, and oxidation resistance at high temperatures.

CERAMICS INTERNATIONAL (2022)

Add to Collection

Article Materials Science, Ceramics

Thin-film temperature sensor made from particle-filled polymer-derived ceramics pyrolyzed in vacuum

Zaifu Cui et al.

Summary: This study proposes the pyrolysis of polymer-derived ceramics (PDC) thin films in vacuum to solve the oxidation issue and verifies its application in high-temperature sensors. It provides a feasible method for the fabrication of high-temperature PDC thin-film sensors.

JOURNAL OF THE EUROPEAN CERAMIC SOCIETY (2022)

Add to Collection

Article Engineering, Electrical & Electronic

TiB2/SiCN Thin-Film Strain Gauges Fabricated by Direct Writing for High-Temperature Application

Chao Wu et al.

Summary: In this study, TiB2/SiCN thin-film strain gauges were fabricated on nickel base alloy substrates for in situ strain monitoring of hot components. The results show that these ceramic-based strain gauges exhibit excellent thermal stability and strain response, with an operating temperature of up to 700 degrees C.

IEEE SENSORS JOURNAL (2022)

Add to Collection

Article Materials Science, Ceramics

High temperature failure modes of In2O3 thin films and improved thermal stability using Al2O3/ZrO2 protective layers

Xinhang Jin et al.

Summary: The study revealed that the failure modes of In2O3 thin film sensors at high temperatures include sublimation and changes in composition, which can be mitigated by protective layers such as Al2O3 and ZrO2. These protection methods effectively increase the thermal stability of In2O3 thin films and reduce damage caused by high temperatures.

CERAMICS INTERNATIONAL (2021)

Add to Collection

Article Materials Science, Ceramics

Influences of different sputtering current on the microstructure and electrical properties of silicon nitride thin films deposited on cemented carbide tools

Di Zhou et al.

Summary: The study found that the sputtering current has an influence on the deposition rate and roughness of SiNx thin films, with higher sputtering current favoring a more uniform and dense film structure. Additionally, annealing at 500 degrees Celsius causes the rupture of Si-N bonds in the films, affecting the insulation performance.

CERAMICS INTERNATIONAL (2021)

Add to Collection

Review Engineering, Electrical & Electronic

Recent Advancements in the Development of Sensors for the Structural Health Monitoring (SHM) at High-Temperature Environment: A Review

Chandan Dutta et al.

Summary: With the rise of Industry 4.0, the significance and utilization of sensors have increased dramatically, particularly in real-time structural health monitoring of components exposed to high temperatures. This review focuses on the development, application, limitations, and recent advancements of sensors used for SHM, specifically addressing challenges and opportunities for high temperature applications.

IEEE SENSORS JOURNAL (2021)

Add to Collection

Article Engineering, Manufacturing

Experimental and numerical fatigue life assessment of SAC305 solders subjected to combined temperature and harmonic vibration loadings

Mohammad Gharaibeh

SOLDERING & SURFACE MOUNT TECHNOLOGY (2020)

Add to Collection

Article Engineering, Electrical & Electronic

A Method for Improving the Thermal Shock Fatigue Failure Resistance of IGBT Modules

Xinyin Zhang et al.

IEEE TRANSACTIONS ON POWER ELECTRONICS (2020)

Add to Collection

Article Engineering, Electrical & Electronic

Effects of Creep Failure Mechanisms on Thermomechanical Reliability of Solder Joints in Power Semiconductors

Vahid Samavatian et al.

IEEE TRANSACTIONS ON POWER ELECTRONICS (2020)

Add to Collection

Article Materials Science, Multidisciplinary

Al2O3-modified PS-PVD 7YSZ thermal barrier coatings for advanced gas-turbine engines

Xiaofeng Zhang et al.

NPJ MATERIALS DEGRADATION (2020)

Add to Collection

Article Materials Science, Ceramics

Influence of a heterolayered Al2O3-ZrO2/Al2O3 ceramic protective overcoat on the high temperature performance of PdCr thin film strain gauges

Hao Liu et al.

CERAMICS INTERNATIONAL (2019)

Add to Collection

Article Materials Science, Ceramics

Effect of TiO2 nanoparticles on the horizontal hardness properties of Sn-3.0Ag-0.5Cu-1.0TiO2 composite solder

Siti Shareeda Mohd Nasir et al.

CERAMICS INTERNATIONAL (2019)

Add to Collection

Article Materials Science, Multidisciplinary

X-Ray Microtomography of Thermal Cycling Damage in Sintered Nano-Silver Solder Joints

Irene Lujan Regalado et al.

ADVANCED ENGINEERING MATERIALS (2019)

Add to Collection

Article Chemistry, Physical

Effect of Al2O3/Al bilayer protective coatings on the high-temperature stability of PdCr thin film strain gages

Shenyong Yang et al.

JOURNAL OF ALLOYS AND COMPOUNDS (2018)

Add to Collection

Article Engineering, Electrical & Electronic

Experimental analysis of Sn-3.0Ag-0.5Cu solder joint board-level drop/vibration impact failure models after thermal/isothermal cycling

Jian Gu et al.

MICROELECTRONICS RELIABILITY (2018)

Add to Collection

Article Engineering, Electrical & Electronic

YSZ/Al2O3 multilayered film as insulating layer for high temperature thin film strain gauge prepared on Ni-based superalloy

Hao Liu et al.

SENSORS AND ACTUATORS A-PHYSICAL (2018)

Add to Collection

Article Engineering, Electrical & Electronic

Failure study of Sn37Pb PBGA solder joints using temperature cycling, random vibration and combined temperature cycling and random vibration tests

Tong An et al.

MICROELECTRONICS RELIABILITY (2018)

Add to Collection

Review Mathematics, Applied

Dynamic response of electronic materials to impact loading: review

E. Suhir et al.

ZAMM-ZEITSCHRIFT FUR ANGEWANDTE MATHEMATIK UND MECHANIK (2017)

Add to Collection

Article Materials Science, Ceramics

Synthesis and characterization of ceramic nanoparticles reinforced lead-free solder

Zahra Fathian et al.

CERAMICS INTERNATIONAL (2017)

Add to Collection

Article Engineering, Electrical & Electronic

Coupling effects of mechanical vibrations and thermal cycling on reliability of CCGA solder joints

Ying Ding et al.

MICROELECTRONICS RELIABILITY (2015)

Add to Collection

Article Engineering, Electrical & Electronic

Random vibration reliability of BGA lead-free solder joint

Fang Liu et al.

MICROELECTRONICS RELIABILITY (2014)

Add to Collection

Article Engineering, Electrical & Electronic

Toward Reliable Power Electronics

Huai Wang et al.

IEEE INDUSTRIAL ELECTRONICS MAGAZINE (2013)

Add to Collection

Article Chemistry, Physical

Microstructure, kinetic analysis and hardness of Sn-Ag-Cu-1 wt% nano-ZrO2 composite solder on OSP-Cu pads

Asit Kumar Gain et al.

JOURNAL OF ALLOYS AND COMPOUNDS (2011)

Add to Collection

Article Materials Science, Multidisciplinary

Reliability evaluation of CSP soldered joints based on FEM and Taguchi method

Huan Ye et al.

COMPUTATIONAL MATERIALS SCIENCE (2010)

Add to Collection

Article Materials Science, Multidisciplinary

Effects of Nano-TiO2 additions on thermal analysis, microstructure and tensile properties of Sn3.5Ag0.25Cu solder

L. C. Tsao et al.

MATERIALS & DESIGN (2010)

Add to Collection

Article Engineering, Electrical & Electronic

Reliability study of board-level lead-free interconnections under sequential thermal cycling and drop impact

Bo Zhang et al.

MICROELECTRONICS RELIABILITY (2009)

Add to Collection

Article Engineering, Manufacturing

The changing automotive environment: High-temperature electronics

RW Johnson et al.

IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING (2004)

Add to Collection

© Peeref 2019-2024. All rights reserved.