Journal
APPLIED PHYSICS EXPRESS
Volume 16, Issue 3, Pages -Publisher
IOP Publishing Ltd
DOI: 10.35848/1882-0786/acc0d3
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We propose and demonstrate a new concept of semiconductor wafer bonding that combines bond formation and solar cell implementation. We develop a semiconductor bonding technique using PEDOT:PSS as a mediator. By utilizing this technique, we create an InP/Si heterostructure with a PEDOT:PSS/Si heterojunction at the bonded interface, which functions as a photovoltaic device. The prepared InP/PEDOT:PSS/Si heterostructure serves as a prototype for a multijunction solar cell with a built-in subcell, and our semiconductor bonding scheme could potentially enable low-cost, high-throughput production of high-efficiency multijunction solar cells.
We propose and experimentally demonstrate a novel concept of semiconductor wafer bonding that simultaneously realizes bond formation and solar cell implementation. Firstly, a semiconductor bonding technique mediated by poly(3,4-ethylenedioxythiophene)-poly(styrenesulfonate) (PEDOT:PSS) is developed. By utilizing the PEDOT:PSS-mediated bonding, we subsequently fabricate an InP/Si heterostructure. The PEDOT: PSS/Si heterojunction derivatively formed at the bonded interface is then demonstrated to operate as a photovoltaic device. The prepared InP/ PEDOT:PSS/Si heterostructure can thus be regarded as a prototype architecture representing an intermediate section of a multijunction solar cell with a built-in subcell. Our facile semiconductor bonding scheme mediated by functional agents could lead to low-cost, high-throughput production of high-efficiency multijunction solar cells. (c) 2023 The Japan Society of Applied Physics
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