4.8 Article

C-Au Covalently Bonded Molecular Junctions Using Nonprotected Alkynyl Anchoring Groups

Journal

JOURNAL OF THE AMERICAN CHEMICAL SOCIETY
Volume 138, Issue 27, Pages 8465-8469

Publisher

AMER CHEMICAL SOC
DOI: 10.1021/jacs.6b03383

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Funding

  1. Dutch organization for Fundamental Research (FOM)
  2. OCW/NWO
  3. ERC advanced grant (Mols@Mols)
  4. China scholarship council (CSC)

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We report on an approach to realize carbon-gold (C-Au) bonded molecular junctions without the need for an additive to deprotect the alkynyl carbon as endstanding anchor group. Using the mechanically controlled break junction (MCBJ) technique, we determine the most probable conductance value of a family of alkynyl terminated oligophenylenes (OPA(n)) connected to gold electrodes through such an akynyl moiety in ambient conditions. The molecules bind to the gold leads through an sp-hybridized carbon atom at each side. Comparing our results with other families of molecules that present organometallic C-Au bonds, we conclude that the conductance of molecules contacted via an sp-hybridized carbon atom is lower than the ones using spa hybridization due to strong differences in the coupling of the conducting orbitals with the gold leads.

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