4.6 Article

Diffraction-Based Strategy for Monitoring Topographical Features Fabricated by Direct Laser Interference Patterning

Journal

ADVANCED ENGINEERING MATERIALS
Volume 25, Issue 13, Pages -

Publisher

WILEY-V C H VERLAG GMBH
DOI: 10.1002/adem.202201889

Keywords

diffraction; direct laser interference patterning; monitor; period; scatterometry; structure depths

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Process monitoring is a crucial strategy in laser-based manufacturing to improve reliability, efficiency, and economic profit. Laser surface texturing workstations utilize monitoring techniques to analyze surface topography and enhance the quality of produced workpieces. In this study, dot-like periodic surface structures were fabricated on stainless steel samples using direct laser interference patterning (DLIP). A scatterometry-based measurement device was used to indirectly determine the depth and period of the topography. The estimated average depth and spatial period of the dot-like structures had relative errors below 15% and 2% respectively. This new process monitoring approach greatly enhances quality assurance in DLIP processing.
Process monitoring in laser-based manufacturing has become a forward-looking strategy for industrial-scale laser machines to increase process reliability, efficiency, and economic profit. Moreover, monitoring techniques are successfully used in laser surface texturing workstations to improve and guarantee the quality of the produced workpieces by analyzing the resulting surface topography. Herein, dot-like periodic surface structures are fabricated on stainless steel samples by direct laser interference patterning (DLIP) using a 70 ps-pulsed laser system at an operating wavelength of 532 nm. A scatterometry-based measurement device is utilized to indirectly determine the mean depth and spatial period of the produced topography by analyzing the recorded diffraction patterns. As a result, the average depth and the spatial period of the dot-like structures can be estimated with a relative error below 15% and 2%, respectively. This new process monitoring approach enables a significant improvement in quality assurance in DLIP processing.

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