4.8 Article

Thermoelectric Performance of Surface-Engineered Cu1.5-xTe-Cu2Se Nanocomposites

Journal

ACS NANO
Volume -, Issue -, Pages -

Publisher

AMER CHEMICAL SOC
DOI: 10.1021/acsnano.3c00495

Keywords

copper telluride; nanoparticles; surface engineering; phase transition; thermoelectric; grain size

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Cu2-xS and Cu2-xSe show promising thermoelectric properties for medium-temperature applications, while Cu2-xTe typically exhibits limited potential due to low Seebeck coefficients. To overcome this, Cu1.5-xTe-Cu2Se nanocomposites were investigated by consolidating surface-engineered Cu1.5Te nanocrystals. The surface engineering strategy allows for precise adjustment of Cu/Te ratios and results in a reversible phase transition, improving the thermoelectric properties. The addition of a layer of Cu2Se effectively inhibits grain growth and reduces thermal conductivity, resulting in a high dimensionless zT of 1.3 at 560 K.
Cu2-xS and Cu2-xSe have recently been reported as promising thermoelectric (TE) materials for medium-temperature applications. In contrast, Cu2-xTe, another member of the copper chalcogenide family, typically exhibits low Seebeck coefficients that limit its potential to achieve a superior thermoelectric figure of merit, zT, particularly in the low-temperature range where this material could be effective. To address this, we investigated the TE performance of Cu1.5-xTe-Cu2Se nanocomposites by consolidat i n g surface-engineered Cu1.5Te nanocrystals. This surface engineering strategy allows for precise adjustment of Cu/Te ratios and results in a reversible phase transition at around 600 K in Cu1.5-xTe-Cu2Se nanocomposites, as systematically confirmed by in situ high-temperature X-ray diffraction combined with differential scanning calorimetry analysis. The phase transition leads to a conversion from metallic-like to semiconducting-like TE properties. Additionally, a layer of Cu2Se generated around Cu1.5-xTe nanoparticles effectively inhibits Cu1.5-xTe grain growth, minimizing thermal conductivity and decreasing hole concentration. These properties indicate that copper telluride based compounds have a promising thermoelectric potential, translated into a high dimensionless zT of 1.3 at 560 K.

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